Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/94272
DC Field | Value | Language |
---|---|---|
dc.contributor | Department of Biomedical Engineering | - |
dc.contributor | Mainland Development Office | - |
dc.contributor | Photonics Research Institute | - |
dc.creator | Li, H | - |
dc.creator | Yu, Z | - |
dc.creator | Zhao, Q | - |
dc.creator | Zhong, T | - |
dc.creator | Lai, P | - |
dc.date.accessioned | 2022-08-11T02:01:33Z | - |
dc.date.available | 2022-08-11T02:01:33Z | - |
dc.identifier.uri | http://hdl.handle.net/10397/94272 | - |
dc.language.iso | en | en_US |
dc.publisher | Cell Press | en_US |
dc.rights | © 2022 The Author(s). This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/). | en_US |
dc.rights | The following publication Li, H., Yu, Z., Zhao, Q., Zhong, T., & Lai, P. (2022). Accelerating deep learning with high energy efficiency: From microchip to physical systems. The Innovation, 3(4), 100252 is available at https://doi.org/10.1016/j.xinn.2022.100252 | en_US |
dc.title | Accelerating deep learning with high energy efficiency : from microchip to physical systems | en_US |
dc.type | Journal/Magazine Article | en_US |
dc.identifier.volume | 3 | - |
dc.identifier.issue | 4 | - |
dc.identifier.doi | 10.1016/j.xinn.2022.100252 | - |
dcterms.accessRights | open access | en_US |
dcterms.bibliographicCitation | The innovation, 12 July 2022, v. 3, no. 4, 100252 | - |
dcterms.isPartOf | The innovation | - |
dcterms.issued | 2022-07 | - |
dc.identifier.scopus | 2-s2.0-85129969755 | - |
dc.identifier.eissn | 2666-6758 | - |
dc.identifier.artn | 100252 | - |
dc.description.validate | 202208 bckw | - |
dc.description.oa | Version of Record | en_US |
dc.identifier.FolderNumber | a1563 | en_US |
dc.identifier.SubFormID | 45430 | en_US |
dc.description.fundingSource | RGC | en_US |
dc.description.fundingSource | Others | en_US |
dc.description.fundingText | National Natural Science Foundation of China; Guangdong Science and Technology Commission; Hong Kong Innovation and Technology Commission | en_US |
dc.description.pubStatus | Published | en_US |
Appears in Collections: | Journal/Magazine Article |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
1-s2.0-S2666675822000480-main.pdf | 417.68 kB | Adobe PDF | View/Open |
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