Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/93
| Title: | Ultrasonic transducer | Authors: | Chan, HLW Or, DSW Choy, CL |
Issue Date: | 11-Sep-2001 | Source: | US Patent 6,286,747 B1. Washington, DC: US Patent and Trademark Office, 2001. | Abstract: | A bonding tool has a driver of piezoelectric elements in a stack. A sensor is positioned and held in the stack and includes a piezoelectric element sandwiched between electrodes and insulating wafers. Voltage developed between the electrodes is monitored and used to determine a bonding parameter, including the amplitude and duration of each ultrasonic burst. | Keywords: | Ultrasonic transducers Bonding tool |
Rights: | Assignee: The Hong Kong Polytechnic University. |
| Appears in Collections: | Patent |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| us6286747b1.pdf | 362.79 kB | Adobe PDF | View/Open |
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