Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/93
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dc.contributorDepartment of Applied Physics-
dc.creatorChan, HLW-
dc.creatorOr, DSW-
dc.creatorChoy, CL-
dc.date.accessioned2008-10-29T09:52:43Z-
dc.date.available2008-10-29T09:52:43Z-
dc.identifier.urihttp://hdl.handle.net/10397/93-
dc.language.isoenen_US
dc.rightsAssignee: The Hong Kong Polytechnic University.en_US
dc.subjectUltrasonic transducersen_US
dc.subjectBonding toolen_US
dc.titleUltrasonic transduceren_US
dc.typePatenten_US
dc.description.otherinformationInventor name used in this publication: Chung Loong Choyen_US
dc.description.otherinformationInventor name used in this publication: Helen Lai Wa Chanen_US
dc.description.otherinformationUS6286747; US6286747 B1; US6286747B1; US6,286,747; US 6,286,747 B1; 6286747; Application No. 09/533,786en_US
dc.description.otherinformationInventor name used in this publication: Siu Wing Oren_US
dcterms.abstractA bonding tool has a driver of piezoelectric elements in a stack. A sensor is positioned and held in the stack and includes a piezoelectric element sandwiched between electrodes and insulating wafers. Voltage developed between the electrodes is monitored and used to determine a bonding parameter, including the amplitude and duration of each ultrasonic burst.-
dcterms.bibliographicCitationUS Patent 6,286,747 B1. Washington, DC: US Patent and Trademark Office, 2001.-
dcterms.issued2001-09-11-
dc.description.countryUS-
dc.description.oaVersion of Recorden_US
Appears in Collections:Patent
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