Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/93
DC Field | Value | Language |
---|---|---|
dc.contributor | Department of Applied Physics | - |
dc.creator | Chan, HLW | - |
dc.creator | Or, DSW | - |
dc.creator | Choy, CL | - |
dc.date.accessioned | 2008-10-29T09:52:43Z | - |
dc.date.available | 2008-10-29T09:52:43Z | - |
dc.identifier.uri | http://hdl.handle.net/10397/93 | - |
dc.language.iso | en | en_US |
dc.rights | Assignee: The Hong Kong Polytechnic University. | en_US |
dc.subject | Ultrasonic transducers | en_US |
dc.subject | Bonding tool | en_US |
dc.title | Ultrasonic transducer | en_US |
dc.type | Patent | en_US |
dc.description.otherinformation | Inventor name used in this publication: Chung Loong Choy | en_US |
dc.description.otherinformation | Inventor name used in this publication: Helen Lai Wa Chan | en_US |
dc.description.otherinformation | US6286747; US6286747 B1; US6286747B1; US6,286,747; US 6,286,747 B1; 6286747; Application No. 09/533,786 | en_US |
dc.description.otherinformation | Inventor name used in this publication: Siu Wing Or | en_US |
dcterms.abstract | A bonding tool has a driver of piezoelectric elements in a stack. A sensor is positioned and held in the stack and includes a piezoelectric element sandwiched between electrodes and insulating wafers. Voltage developed between the electrodes is monitored and used to determine a bonding parameter, including the amplitude and duration of each ultrasonic burst. | - |
dcterms.bibliographicCitation | US Patent 6,286,747 B1. Washington, DC: US Patent and Trademark Office, 2001. | - |
dcterms.issued | 2001-09-11 | - |
dc.description.country | US | - |
dc.description.oa | Version of Record | en_US |
Appears in Collections: | Patent |
Files in This Item:
File | Description | Size | Format | |
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us6286747b1.pdf | 362.79 kB | Adobe PDF | View/Open |
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