Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/92419
DC Field | Value | Language |
---|---|---|
dc.contributor | Institute of Textiles and Clothing | en_US |
dc.contributor | College of Professional and Continuing Education | en_US |
dc.creator | Yang, S | en_US |
dc.creator | Liu, S | en_US |
dc.creator | Ding, X | en_US |
dc.creator | Zhu, B | en_US |
dc.creator | Shi, J | en_US |
dc.creator | Yang, B | en_US |
dc.creator | Liu, S | en_US |
dc.creator | Chen, W | en_US |
dc.creator | Tao, X | en_US |
dc.date.accessioned | 2022-04-01T01:55:51Z | - |
dc.date.available | 2022-04-01T01:55:51Z | - |
dc.identifier.issn | 0266-3538 | en_US |
dc.identifier.uri | http://hdl.handle.net/10397/92419 | - |
dc.language.iso | en | en_US |
dc.publisher | Pergamon Press | en_US |
dc.rights | © 2021 Elsevier Ltd. All rights reserved. | en_US |
dc.rights | © 2021. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/. | en_US |
dc.rights | The following publication Yang, S., Liu, S., Ding, X., Zhu, B., Shi, J., Yang, B., . . . Tao, X. (2021). Permeable and washable electronics based on polyamide fibrous membrane for wearable applications. Composites Science and Technology, 207, 108729 is available at https://dx.doi.org/10.1016/j.compscitech.2021.108729. | en_US |
dc.subject | Fibrous membrane | en_US |
dc.subject | Interconnector | en_US |
dc.subject | Washability | en_US |
dc.subject | Wearables | en_US |
dc.title | Permeable and washable electronics based on polyamide fibrous membrane for wearable applications | en_US |
dc.type | Journal/Magazine Article | en_US |
dc.identifier.volume | 207 | en_US |
dc.identifier.doi | 10.1016/j.compscitech.2021.108729 | en_US |
dcterms.abstract | Integrating electronics in clothing is a significant milestone of wearable technology. The priority is to develop flexible interconnector with great washability, durability and comfort wearability. In this work, we reported an air-permeable and machine-washable Cu/Ni interconnector based on highly flexible fibrous polyimide (FPI) membrane. Benefiting from the porous merit of FPI membrane and robust parylene encapsulation, the novel interconnector presents excellent conductivity (14 mΩ/sq), decent air-permeability (11 KPa*s/m) and superior electromechanical stability after abrasion of 50,000 cycles, bending of 10,000 cycles, and machine washing of 50 times. Moreover, assemblies made from the FPI-based circuit board not only show desirable lifespan in harsh environments, including seawater, ice, boiled water, and heavy rain, but also can be woven into fabrics for broad wearable applications. The work presents a facile and effective method to fabricate highly flexible, comfortable and durable interconnector, guaranteeing the reliability for long-term wearable application and showing great possibility for high-throughput production. | en_US |
dcterms.accessRights | open access | en_US |
dcterms.bibliographicCitation | Composites science and technology, 3 May 2021, v. 207, 108729 | en_US |
dcterms.isPartOf | Composites science and technology | en_US |
dcterms.issued | 2021-05-03 | - |
dc.identifier.scopus | 2-s2.0-85101874330 | - |
dc.identifier.eissn | 1879-1050 | en_US |
dc.identifier.artn | 108729 | en_US |
dc.description.validate | 202203 bcch | en_US |
dc.description.oa | Accepted Manuscript | en_US |
dc.identifier.FolderNumber | a1239-n04, ITC-0067 | - |
dc.description.fundingSource | RGC | en_US |
dc.description.fundingSource | Others | en_US |
dc.description.fundingText | RGC: Project No.15200917E | en_US |
dc.description.fundingText | Others: P0012622, Endowed Professorship Fund, The Hong Kong Polytechnic University (No.847A) | en_US |
dc.description.pubStatus | Published | en_US |
dc.identifier.OPUS | 50338561 | - |
Appears in Collections: | Journal/Magazine Article |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
Yang_Permeable_Washable_Electronics.pdf | Pre-Published version | 2.77 MB | Adobe PDF | View/Open |
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