Back to results list
Please use this identifier to cite or link to this item:
|Title:||A smart epoxy composite based on phase change microcapsules : preparation, microstructure, thermal and dynamic mechanical performances||Authors:||Hu, QH
|Keywords:||Phase change materials
Dynamic mechanical properties
|Issue Date:||2019||Publisher:||Molecular Diversity Preservation International (MDPI)||Source:||Molecules, 1 Mar. 2019, v. 24, no. 5, 916, p. 1-20 How to cite?||Journal:||Molecules||Abstract:||Microencapsulated phase change materials (MicroPCMs)-incorporated in epoxy composites have drawn increasing interest due to their promising application potential in the fields of thermal energy storage and temperature regulation. However, the study on the effect of MicroPCMs on their microstructure, thermal and viscoelastic properties is quite limited. Herein, a new type of smart epoxy composite incorporated with polyurea (PU)-shelled MicroPCMs was fabricated via solution casting method. Field emission-scanning electron microscope (FE-SEM) images revealed that the MicroPCMs were uniformly distributed in the epoxy matrix. The thermal stabilities, conductivities, phase change properties, and dynamic mechanical behaviors of the composite were studied by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), thermal constant analyzer and infrared thermography. The results suggested that the heat storage ability of the composites was improved by increasing the MicroPCMs content. The thermal stability of MicroPCMs was found to be enhanced after incorporation into the matrix, and the MicroPCMs-incorporated epoxy composites showed a good thermal cycling reliability. Moreover, the incorporation of MicroPCMs reduced the composites' storage modulus but increased the glass transition temperature (T-g) as a result of their restriction to the chain motion of epoxy resin. Besides, a less marked heating effect for the composite was explored through infrared thermography analysis, demonstrating the good prospect for temperature regulation application.||URI:||http://hdl.handle.net/10397/80741||ISSN:||1420-3049||DOI:||10.3390/molecules24050916||Rights:||© 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
The following publication Hu, Q.; Chen, Y.; Hong, J.; Jin, S.; Zou, G.; Chen, L.; Chen, D.-Z. A Smart Epoxy Composite Based on Phase Change Microcapsules: Preparation, Microstructure, Thermal and Dynamic Mechanical Performances. Molecules 2019, 24, 916, 14 pages is available at https://dx.doi.org/10.3390/molecules24050916
|Appears in Collections:||Journal/Magazine Article|
Show full item record
Files in This Item:
|Hu_Epoxy_Phase_Microcapsules.pdf||3.68 MB||Adobe PDF||View/Open|
Citations as of Jul 16, 2019
Citations as of Jul 16, 2019
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.