Please use this identifier to cite or link to this item:
Title: Ultrathin large-size direct-type backlight module
Other Titles: 超薄大尺寸直下式背光模块
Authors: To, S 
Wang, B 
Cheung, KC 
Lee, WB 
Li, MH 
Wang, WK 
Wong, CM 
Cheng, PL 
Cheng, SF 
Koi, XJ
Li, LH
Ho, H
Issue Date: 15-Aug-2017
Source: 中国专利 ZL 201310051842.5 How to cite?
Abstract: The invention provides an ultrathin large-size direct-type backlight module. The ultrathin large-size direct-type backlight module comprises a circuit board, an enclosure frame, a bottom surface reflection sheet and a diffusion barrier, wherein the circuit board is provided with a plurality of LEDs (light emitting diode); the enclosure frame is fixed on the peripheral side of the circuit board; the bottom surface reflection sheet is fixed on the circuit board and provided with a plurality of installation through holes, and the installation through holes respectively correspond to a plurality of LEDs; a plurality of lens are installed on the circuit board and respectively arranged in a corresponding installation through hole, and the top surfaces of the lens stay on the same plane; the diffusion barrier is arranged on the top surface of the lens. On the basis of uniformity in emitting light, the thickness of the backlight module is greatly reduced, so that the thickness of the ultrathin large-size direct-type backlight module can be greatly reduced. Meanwhile, fewer LEDs and fewer diffusion barriers can be used, so that the cost can be reduced.
Rights: Assignee: The Hong Kong Polytechnic University
Appears in Collections:Patent

Files in This Item:
File Description SizeFormat 
ZL201310051842.5.PDF1.43 MBAdobe PDFView/Open
Show full item record
PIRA download icon_1.1View/Download Contents

Page view(s)

Citations as of Dec 3, 2018

Google ScholarTM


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.