Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/76861
DC Field | Value | Language |
---|---|---|
dc.contributor | Department of Industrial and Systems Engineering | - |
dc.contributor | Innovation and Technology Development Office | - |
dc.creator | To, S | - |
dc.creator | Wang, B | - |
dc.creator | Cheung, KC | - |
dc.creator | Lee, WB | - |
dc.creator | Li, MH | - |
dc.creator | Wang, WK | - |
dc.creator | Wong, CM | - |
dc.creator | Cheng, PL | - |
dc.creator | Cheng, SF | - |
dc.creator | Koi, XJ | - |
dc.creator | Li, LH | - |
dc.creator | Ho, H | - |
dc.date.accessioned | 2018-06-15T02:11:37Z | - |
dc.date.available | 2018-06-15T02:11:37Z | - |
dc.identifier.uri | http://hdl.handle.net/10397/76861 | - |
dc.language.iso | zh | en_US |
dc.rights | Assignee: The Hong Kong Polytechnic University | en_US |
dc.title | Ultrathin large-size direct-type backlight module | en_US |
dc.type | Patent | en_US |
dc.description.otherinformation | Inventor name used in this publication: 杜雪 | en_US |
dc.description.otherinformation | Inventor name used in this publication: 王波 | en_US |
dc.description.otherinformation | Inventor name used in this publication: 张家儁 | en_US |
dc.description.otherinformation | Inventor name used in this publication: 李荣彬 | en_US |
dc.description.otherinformation | Inventor name used in this publication: 李敏行 | en_US |
dc.description.otherinformation | Inventor name used in this publication: 王文奎 | en_US |
dc.description.otherinformation | Inventor name used in this publication: 黄卓明 | en_US |
dc.description.otherinformation | Inventor name used in this publication: 郑伯龙 | en_US |
dc.description.otherinformation | Inventor name used in this publication: 郑小虎 | en_US |
dc.description.otherinformation | Inventor name used in this publication: 寇晓君 | en_US |
dc.description.otherinformation | Inventor name used in this publication: 李力行 | en_US |
dc.description.otherinformation | Inventor name used in this publication: 何熙 | en_US |
dc.description.otherinformation | Title in Traditional Chinese: 超薄大尺寸直下式背光模組 | en_US |
dcterms.abstract | The invention provides an ultrathin large-size direct-type backlight module. The ultrathin large-size direct-type backlight module comprises a circuit board, an enclosure frame, a bottom surface reflection sheet and a diffusion barrier, wherein the circuit board is provided with a plurality of LEDs (light emitting diode); the enclosure frame is fixed on the peripheral side of the circuit board; the bottom surface reflection sheet is fixed on the circuit board and provided with a plurality of installation through holes, and the installation through holes respectively correspond to a plurality of LEDs; a plurality of lens are installed on the circuit board and respectively arranged in a corresponding installation through hole, and the top surfaces of the lens stay on the same plane; the diffusion barrier is arranged on the top surface of the lens. On the basis of uniformity in emitting light, the thickness of the backlight module is greatly reduced, so that the thickness of the ultrathin large-size direct-type backlight module can be greatly reduced. Meanwhile, fewer LEDs and fewer diffusion barriers can be used, so that the cost can be reduced. | - |
dcterms.abstract | 本发明提供一种超薄大尺寸直下式背光模块,包括:线路板、围框、底面反射片和扩散膜,线路板上具有若干个LED;围框固定于线路板的周侧;底面反射片固定于线路板,具有若干个安装通孔,且若干个安装通孔分别对应于若干个LED;若干个透镜安装于线路板上,并各自位于相应的安装通孔内,若干个透镜的顶面在同一平面上;扩散膜铺设于若干个透镜的顶面。本发明在出光均匀的基础上,大幅度降低了背光模块的厚度,故本发明的超薄大尺寸直下式背光模块厚度可以做得非常薄。同时,本发明可以使用较少数量的LED颗数和较少的扩散膜片数,有利于降低成本。 | - |
dcterms.alternative | 超薄大尺寸直下式背光模块 | - |
dcterms.bibliographicCitation | 中国专利 ZL 201310051842.5 | - |
dcterms.issued | 2017-8-15 | - |
dc.identifier.ros | 2016002159 | - |
dc.description.country | China | - |
dc.description.validate | 201806 bcrc | - |
dc.description.oa | Version of Record | en_US |
Appears in Collections: | Patent |
Files in This Item:
File | Description | Size | Format | |
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ZL201310051842.5.PDF | 1.43 MB | Adobe PDF | View/Open |
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