Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/76861
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dc.contributorDepartment of Industrial and Systems Engineering-
dc.contributorInnovation and Technology Development Office-
dc.creatorTo, S-
dc.creatorWang, B-
dc.creatorCheung, KC-
dc.creatorLee, WB-
dc.creatorLi, MH-
dc.creatorWang, WK-
dc.creatorWong, CM-
dc.creatorCheng, PL-
dc.creatorCheng, SF-
dc.creatorKoi, XJ-
dc.creatorLi, LH-
dc.creatorHo, H-
dc.date.accessioned2018-06-15T02:11:37Z-
dc.date.available2018-06-15T02:11:37Z-
dc.identifier.urihttp://hdl.handle.net/10397/76861-
dc.language.isozhen_US
dc.rightsAssignee: The Hong Kong Polytechnic Universityen_US
dc.titleUltrathin large-size direct-type backlight moduleen_US
dc.typePatenten_US
dc.description.otherinformationInventor name used in this publication: 杜雪en_US
dc.description.otherinformationInventor name used in this publication: 王波en_US
dc.description.otherinformationInventor name used in this publication: 张家儁en_US
dc.description.otherinformationInventor name used in this publication: 李荣彬en_US
dc.description.otherinformationInventor name used in this publication: 李敏行en_US
dc.description.otherinformationInventor name used in this publication: 王文奎en_US
dc.description.otherinformationInventor name used in this publication: 黄卓明en_US
dc.description.otherinformationInventor name used in this publication: 郑伯龙en_US
dc.description.otherinformationInventor name used in this publication: 郑小虎en_US
dc.description.otherinformationInventor name used in this publication: 寇晓君en_US
dc.description.otherinformationInventor name used in this publication: 李力行en_US
dc.description.otherinformationInventor name used in this publication: 何熙en_US
dc.description.otherinformationTitle in Traditional Chinese: 超薄大尺寸直下式背光模組en_US
dcterms.abstractThe invention provides an ultrathin large-size direct-type backlight module. The ultrathin large-size direct-type backlight module comprises a circuit board, an enclosure frame, a bottom surface reflection sheet and a diffusion barrier, wherein the circuit board is provided with a plurality of LEDs (light emitting diode); the enclosure frame is fixed on the peripheral side of the circuit board; the bottom surface reflection sheet is fixed on the circuit board and provided with a plurality of installation through holes, and the installation through holes respectively correspond to a plurality of LEDs; a plurality of lens are installed on the circuit board and respectively arranged in a corresponding installation through hole, and the top surfaces of the lens stay on the same plane; the diffusion barrier is arranged on the top surface of the lens. On the basis of uniformity in emitting light, the thickness of the backlight module is greatly reduced, so that the thickness of the ultrathin large-size direct-type backlight module can be greatly reduced. Meanwhile, fewer LEDs and fewer diffusion barriers can be used, so that the cost can be reduced.-
dcterms.abstract本发明提供一种超薄大尺寸直下式背光模块,包括:线路板、围框、底面反射片和扩散膜,线路板上具有若干个LED;围框固定于线路板的周侧;底面反射片固定于线路板,具有若干个安装通孔,且若干个安装通孔分别对应于若干个LED;若干个透镜安装于线路板上,并各自位于相应的安装通孔内,若干个透镜的顶面在同一平面上;扩散膜铺设于若干个透镜的顶面。本发明在出光均匀的基础上,大幅度降低了背光模块的厚度,故本发明的超薄大尺寸直下式背光模块厚度可以做得非常薄。同时,本发明可以使用较少数量的LED颗数和较少的扩散膜片数,有利于降低成本。-
dcterms.alternative超薄大尺寸直下式背光模块-
dcterms.bibliographicCitation中国专利 ZL 201310051842.5-
dcterms.issued2017-8-15-
dc.identifier.ros2016002159-
dc.description.countryChina-
dc.description.validate201806 bcrc-
dc.description.oaVersion of Recorden_US
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