Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/7658
| Title: | Polymer-bonded magnetic materials | Authors: | Cheng, KWE Wong, YW Wu, WT Ding, K Ho, YL Cheung, TK Cheong, CK |
Issue Date: | 2-Oct-2012 | Source: | US Patent 8,277,678 B2. Washington, DC: US Patent and Trademark Office, 2012. | Abstract: | A magnetic composition for power conversion includes a thermoplastic polymer and magnetic powders. The composition has a tensile strength of greater than 20 N/mm². | Rights: | Assignee: The Hong Kong Polytechnic University. |
| Appears in Collections: | Patent |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| us8277678b2.pdf | 472.15 kB | Adobe PDF | View/Open |
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