Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/7658
Title: Polymer-bonded magnetic materials
Authors: Cheng, KWE 
Wong, YW
Wu, WT
Ding, K
Ho, YL
Cheung, TK
Cheong, CK
Issue Date: 2-Oct-2012
Source: US Patent 8,277,678 B2. Washington, DC: US Patent and Trademark Office, 2012. How to cite?
Abstract: A magnetic composition for power conversion includes a thermoplastic polymer and magnetic powders. The composition has a tensile strength of greater than 20 N/mm².
URI: http://hdl.handle.net/10397/7658
Rights: Assignee: The Hong Kong Polytechnic University.
Appears in Collections:Patent

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