Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/7658
DC Field | Value | Language |
---|---|---|
dc.contributor | Department of Electrical Engineering | - |
dc.creator | Cheng, KWE | - |
dc.creator | Wong, YW | - |
dc.creator | Wu, WT | - |
dc.creator | Ding, K | - |
dc.creator | Ho, YL | - |
dc.creator | Cheung, TK | - |
dc.creator | Cheong, CK | - |
dc.date.accessioned | 2015-10-27T00:44:31Z | - |
dc.date.available | 2015-10-27T00:44:31Z | - |
dc.identifier.uri | http://hdl.handle.net/10397/7658 | - |
dc.language.iso | en | en_US |
dc.rights | Assignee: The Hong Kong Polytechnic University. | en_US |
dc.title | Polymer-bonded magnetic materials | en_US |
dc.type | Patent | en_US |
dc.description.otherinformation | US8277678; US8277678 B2; US8277678B2; US8,277,678; US 8,277,678 B2; 8277678; Appl. No. 12/039,592 | en_US |
dc.description.otherinformation | Inventor name used in this publication: Ka Wai Eric Cheng | en_US |
dc.description.otherinformation | Inventor name used in this publication: Chi Keong Cheong | en_US |
dcterms.abstract | A magnetic composition for power conversion includes a thermoplastic polymer and magnetic powders. The composition has a tensile strength of greater than 20 N/mm². | - |
dcterms.bibliographicCitation | US Patent 8,277,678 B2. Washington, DC: US Patent and Trademark Office, 2012. | - |
dcterms.issued | 2012-10-02 | - |
dc.description.country | US | - |
dc.description.oa | Version of Record | en_US |
Appears in Collections: | Patent |
Files in This Item:
File | Description | Size | Format | |
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us8277678b2.pdf | 472.15 kB | Adobe PDF | View/Open |
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