Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/68408
| Title: | Process for making nickel electroforms | Authors: | Wong, KP Chan, KC Yue, TM |
Issue Date: | 16-Sep-2003 | Source: | US Patent 6,620,303 B2. Washington, DC: US Patent and Trademark Office, 2003. | Abstract: | It is known to apply a pulse current during electrodeposition of nickel. In the invention, pulse current waveforms have ramp-down spikes leading to improvements in surface finishes of electroforms created by the process. | Rights: | Assignee: The Hong Kong Polytechnic Univeristy. |
| Appears in Collections: | Patent |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| us6620303b2.pdf | 233.1 kB | Adobe PDF | View/Open |
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