Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/68408
DC Field | Value | Language |
---|---|---|
dc.contributor | Department of Industrial and Systems Engineering | - |
dc.creator | Wong, KP | - |
dc.creator | Chan, KC | - |
dc.creator | Yue, TM | - |
dc.date.accessioned | 2017-08-22T05:54:57Z | - |
dc.date.available | 2017-08-22T05:54:57Z | - |
dc.identifier.uri | http://hdl.handle.net/10397/68408 | - |
dc.language.iso | en | en_US |
dc.rights | Assignee: The Hong Kong Polytechnic Univeristy. | en_US |
dc.title | Process for making nickel electroforms | en_US |
dc.type | Patent | en_US |
dc.description.otherinformation | US6620303; US6620303 B2; US6620303B2; US6,620,303; US 6,620,303 B2; 6620303; Appl. No. 09/860,758 | en_US |
dcterms.abstract | It is known to apply a pulse current during electrodeposition of nickel. In the invention, pulse current waveforms have ramp-down spikes leading to improvements in surface finishes of electroforms created by the process. | - |
dcterms.bibliographicCitation | US Patent 6,620,303 B2. Washington, DC: US Patent and Trademark Office, 2003. | - |
dcterms.issued | 2003-09-16 | - |
dc.description.country | US | - |
dc.identifier.rosgroupid | r18677 | - |
dc.description.ros | 2003-2004 > Other Outputs > Patents granted | - |
dc.description.oa | Version of Record | en_US |
Appears in Collections: | Patent |
Files in This Item:
File | Description | Size | Format | |
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us6620303b2.pdf | 233.1 kB | Adobe PDF | View/Open |
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