Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/64537
Title: A relaxation scheme for TSP-based 3D printing path optimizer
Authors: Fok, KY
Cheng, CT 
Tse, CK 
Ganganath, N
Keywords: Additive manufacturing
3D printing
TSP
Optimisation
Relaxation
Issue Date: 2016
Publisher: Institute of Electrical and Electronics Engineers
Source: 2016 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC), Chengdu, China, 13-15 Oct 2016, p. 382-385 How to cite?
Abstract: Additive-layered manufacturing has gained attentionin recent years as it has many advantages over conventionalinjection moulding methods. The optimization of printing trajectoriescan be formulated as a travelling salesman problem (TSP) and solved accordingly. However, computational complexities ofordinary TSP solvers can increase tremendously with the scaleof the problem, which make them impractical. In this work, arelaxation scheme for TSP-based 3D printing path optimizer isproposed. Simulation results show that the proposed scheme cansignificantly shorten the computational time of the optimizationprocess with insignificant impact on solution quality.
URI: http://hdl.handle.net/10397/64537
ISBN: 978-1-5090-5154-0 (electronic)
978-1-5090-5155-7 (print on demand(PoD))
DOI: 10.1109/CyberC.2016.80
Rights: © 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
The following publication K. Y. Fok, C. T. Cheng, C. K. Tse and N. Ganganath, "A Relaxation Scheme for TSP-Based 3D Printing Path Optimizer," 2016 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC), Chengdu, China, 2016, pp. 382-385 is available at http://dx.doi.org/10.1109/CyberC.2016.80
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