Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/64537
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dc.contributorDepartment of Electronic and Information Engineering-
dc.creatorFok, KY-
dc.creatorCheng, CT-
dc.creatorTse, CK-
dc.creatorGanganath, N-
dc.date.accessioned2017-03-03T03:49:12Z-
dc.date.available2017-03-03T03:49:12Z-
dc.identifier.isbn978-1-5090-5154-0 (electronic)-
dc.identifier.isbn978-1-5090-5155-7 (print on demand(PoD))-
dc.identifier.urihttp://hdl.handle.net/10397/64537-
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineersen_US
dc.rights© 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en_US
dc.rightsThe following publication K. Y. Fok, C. T. Cheng, C. K. Tse and N. Ganganath, "A Relaxation Scheme for TSP-Based 3D Printing Path Optimizer," 2016 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC), Chengdu, China, 2016, pp. 382-385 is available at http://dx.doi.org/10.1109/CyberC.2016.80en_US
dc.subjectAdditive manufacturingen_US
dc.subject3D printingen_US
dc.subjectTSPen_US
dc.subjectOptimisationen_US
dc.subjectRelaxationen_US
dc.titleA relaxation scheme for TSP-based 3D printing path optimizeren_US
dc.typeConference Paperen_US
dc.identifier.spage382-
dc.identifier.epage385-
dc.identifier.doi10.1109/CyberC.2016.80-
dcterms.abstractAdditive-layered manufacturing has gained attentionin recent years as it has many advantages over conventionalinjection moulding methods. The optimization of printing trajectoriescan be formulated as a travelling salesman problem (TSP) and solved accordingly. However, computational complexities ofordinary TSP solvers can increase tremendously with the scaleof the problem, which make them impractical. In this work, arelaxation scheme for TSP-based 3D printing path optimizer isproposed. Simulation results show that the proposed scheme cansignificantly shorten the computational time of the optimizationprocess with insignificant impact on solution quality.-
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitation2016 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC), Chengdu, China, 13-15 Oct 2016, p. 382-385-
dcterms.issued2016-
dc.identifier.ros2016005628-
dc.relation.conferenceInternational Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery [CyberC]-
dc.identifier.rosgroupid2016005377-
dc.description.ros2016-2017 > Academic research: refereed > Refereed conference paper-
dc.description.validate201804_a bcma-
dc.description.oaAccepted Manuscripten_US
dc.identifier.FolderNumbera0057-n01en_US
dc.description.pubStatusPublisheden_US
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