Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/60277
Title: A comparative study on migratory properties of copper in nickel, cobalt and palladium deposits
Other Titles: 镍、钴、钯镀层的防铜渗性能比较
Authors: Ng, WY
Man, HC 
Yeung, CH
Siu, CL
Lee, CY
Keywords: Metal diffusion
Copper barrier layer
Nickel
Cobalt
Palladium
Electroplating
Issue Date: 2000
Publisher: 中國學術期刊 (光盤版) 電子雜誌社
Source: 电镀与涂饰 (Electroplating & finishing), Aug. 2000, v. 19, no. 4, p. 4-7 How to cite?
Journal: 电镀与涂饰 (Electroplating & finishing) 
Abstract: 以镍、钴、钯镀层作为铜基体镀金的防渗铜中间层可以有效地防止铜原子扩散到金属表面。采用SEM、EDAX、XRD等方法研究铜在该 3种金属内的扩散机理和扩散系数 ,探讨了扩散过程与这 3种金属晶体结构、晶粒大小以及X -射线衍射特性的关系。
Nickel, cobalt and palladium electrodeposits used as barrier layer between copper basis and gold deposit can effectively reduce migration of copper atom to gold upper deposit. The diffusion mechanism and diffusion coefficient of copper in the three metals were studied by means of SEM, EDAX and X-ray diffraction. The relationship between the diffusion process and the crystalline structure, grain size, X ray diffraction properties of the three metals were also discussed.
URI: http://hdl.handle.net/10397/60277
ISSN: 1004-227X
Rights: © 2000 中国学术期刊电子杂志出版社。本内容的使用仅限于教育、科研之目的。
© 2000 China Academic Journal Electronic Publishing House. It is to be used strictly for educational and research purposes.
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