Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/60270
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dc.contributorDepartment of Industrial and Systems Engineering-
dc.creatorChan, CY-
dc.creatorYung, KC-
dc.date.accessioned2016-11-21T02:36:28Z-
dc.date.available2016-11-21T02:36:28Z-
dc.identifier.issn1001-2028-
dc.identifier.urihttp://hdl.handle.net/10397/60270-
dc.language.isozhen_US
dc.publisher中国电子学会元件分会en_US
dc.rights© 2005 中国学术期刊电子杂志出版社。本内容的使用仅限于教育、科研之目的。en_US
dc.rights© 2005 China Academic Journal Electronic Publishing House. It is to be used strictly for educational and research purposes.en_US
dc.subjectElectronic technologyen_US
dc.subjectEmbedded resistoren_US
dc.subjectPCBen_US
dc.subjectThermal characteristicsen_US
dc.subjectDesign rulesen_US
dc.titleInvestigation of thermal characteristics of embedded resistorsen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.spage61-
dc.identifier.epage63-
dc.identifier.volume24-
dc.identifier.issue12-
dc.identifier.doi10.14106/j.cnki.1001-2028.2005.12.019-
dcterms.abstract通过对电阻的热功率、表面积的分析,研究了PCB板中的埋入式电阻的热特性,给出了PCB板中埋入式电阻的温升的解析表达式。计算了埋入式电阻在PCB板中的不同位置的温升情况,详细讨论了多个埋入式电阻的温升与单个电阻温升的关系,得到了计算具有多个埋入式电阻的PCB板的温升的方法。在设计PCB板时,大功率埋入式电阻应安排在板的中部,埋入式电阻的相互距离要分散并远离PCB板表面。-
dcterms.abstractThermal characteristics of embedded resistors in PCB(Printed Circuit Board)were studied.From the investigations of powers and surface areas of embedded resistors,the parse function of temperature rise in PCB was formulated.The differences in temperature rises against various locations in a PCB with embedded resistors also were calculated.From the analysis on relationships between single resistor and multi resistors,the calculation method of temperature rise in PCB with multi embedded resistors are presented.It was observed that an embedded resistor with large power should be placed at the center of a board and each heat source should maintain a distance among each other.-
dcterms.accessRightsopen accessen_US
dcterms.alternative埋入式电阻的热特性研究-
dcterms.bibliographicCitation电子元件与材料 (Electronic components & materials), Dec. 2005, v. 24, no. 12, p. 61-63-
dcterms.isPartOf电子元件与材料 (Electronic components & materials)-
dcterms.issued2005-
dc.identifier.rosgroupidr29544-
dc.description.ros2005-2006 > Academic research: refereed > Publication in refereed journal-
dc.description.oaVersion of Recorden_US
dc.identifier.FolderNumberOA_IR/PIRAen_US
dc.description.pubStatusPublisheden_US
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