Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/6022
DC Field | Value | Language |
---|---|---|
dc.contributor | Department of Applied Physics | - |
dc.contributor | Materials Research Centre | - |
dc.creator | Ong, CW | - |
dc.creator | Wong, HY | - |
dc.creator | Pang, GKH | - |
dc.creator | Baba-Kishi, KZ | - |
dc.creator | Choy, CL | - |
dc.date.accessioned | 2014-12-11T08:24:21Z | - |
dc.date.available | 2014-12-11T08:24:21Z | - |
dc.identifier.issn | 0884-2914 | - |
dc.identifier.uri | http://hdl.handle.net/10397/6022 | - |
dc.language.iso | en | en_US |
dc.publisher | Cambridge University Press | en_US |
dc.rights | © 2001 Materials Research Society | en_US |
dc.rights | The following article "C. W. Ong, H. Y. Wong, G. K. H. Pang, K. Z. Baba-Kishi and C. L. Choy (2001). Relationship between the microstructure and nanoindentation hardness of thermally evaporated and magnetron-sputtered electrochromic tungsten oxide films. Journal of Materials Research, 16(6), p. 1541-1548. doi:10.1557/JMR.2001.0214." is available at http://journals.cambridge.org/action/displayAbstract?fromPage=online&aid=7998492 | en_US |
dc.subject | Amorphous films | en_US |
dc.subject | Atomic force microscopy | en_US |
dc.subject | Crystal microstructure | en_US |
dc.subject | Crystalization | en_US |
dc.subject | Densification | en_US |
dc.subject | Elastic moduli | en_US |
dc.subject | Evaporation | en_US |
dc.subject | Grain size and shape | en_US |
dc.subject | High temperature effects | en_US |
dc.subject | Indentation | en_US |
dc.subject | Magnetron sputtering | en_US |
dc.subject | Microhardness | en_US |
dc.subject | Oxygen | en_US |
dc.subject | Polycrystalline materials | en_US |
dc.subject | X ray diffraction analysis | en_US |
dc.subject | X ray photoelectron spectroscopy | en_US |
dc.title | Relationship between the microstructure and nanoindentation hardness of thermally evaporated and magnetron-sputtered electrochromic tungsten oxide films | en_US |
dc.type | Journal/Magazine Article | en_US |
dc.description.otherinformation | Author name used in this publication: G. K. H. Pang | en_US |
dc.description.otherinformation | Author name used in this publication: C. L. Choy | en_US |
dc.identifier.spage | 1541 | - |
dc.identifier.epage | 1548 | - |
dc.identifier.volume | 16 | - |
dc.identifier.issue | 6 | - |
dc.identifier.doi | 10.1557/JMR.2001.0214 | - |
dcterms.abstract | Tungsten oxide (WOₓ) films were fabricated by (i) reactive thermal evaporation (RTE) at room temperature with oxygen ambient pressure Pₒ₍₂₎ as a parameter, and (ii) reactive magnetron sputtering (RMS) with substrate temperature T[sub s] as a parameter. The film structure revealed by x-ray photoelectron spectroscopy, x-ray diffraction, density measurements, infrared absorption, and atomic force microscopy was correlated with the nanoindentation hardness H. The RTE WOₓ films deposited at high Pₒ₍₂₎ were amorphous and porous, while H depended appreciably on normalized penetration depth h[sub D] (indentation depth/film thickness) due to the closing of the pores at the point of indentation. Decrease in Pₒ₍₂₎ from 10 to 2 × 10⁻³ retort led to smaller porosity, weaker h[sub D] dependence of H, and higher average H (measured at h[sub D] ≈ 0.2 to 0.3, for example). The RMS WOₓ film deposited at room temperature was amorphous and denser than all RTE films. The rise in substrate temperature T[sub s] first densified the film structure (up to 110 °C) and then induced crystallization with larger grain size for T[sub s] ≥ 300 °C. Correspondingly, the h D dependence of H became weaker. In particular, H of the RMS sample deposited at 110 °C showed a peak at h[sub D] slightly above 1 owing to pileup at the contact point of indentation. For higher T[sub s], pileup occurred at shallower h[sub D] and the average H (measured at h[sub D] ≈ 0.2 to 0.3, for example) rose, accompanied by the increase of grain size. | - |
dcterms.accessRights | open access | en_US |
dcterms.bibliographicCitation | Journal of materials research, June 2001, v. 16, no. 06, p. 1541-1548 | - |
dcterms.isPartOf | Journal of materials research | - |
dcterms.issued | 2001-06 | - |
dc.identifier.isi | WOS:000169206600003 | - |
dc.identifier.scopus | 2-s2.0-0035382261 | - |
dc.identifier.eissn | 2044-5326 | - |
dc.identifier.rosgroupid | r04098 | - |
dc.description.ros | 2000-2001 > Academic research: refereed > Publication in refereed journal | - |
dc.description.oa | Version of Record | en_US |
dc.identifier.FolderNumber | OA_IR/PIRA | en_US |
dc.description.pubStatus | Published | en_US |
Appears in Collections: | Journal/Magazine Article |
Files in This Item:
File | Description | Size | Format | |
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Ong_Microstructure_Nanoindentation_Hardness.pdf | 374.74 kB | Adobe PDF | View/Open |
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