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Title: Evaluation of the material parameters of piezoelectric materials by various methods
Authors: Kwok, KW 
Chan, HLW 
Choy, CL
Keywords: Ceramic materials
Piezoelectric resonance analysis program (PRAP)
Piezoelectric materials
Issue Date: Jul-1997
Publisher: Institute of Electrical and Electronics Engineers
Source: IEEE transactions on ultrasonics, ferroelectrics, and frequency control, July 1997, v. 44, no. 4, p. 733-742 How to cite?
Journal: IEEE transactions on ultrasonics, ferroelectrics, and frequency control 
Abstract: The elastic, dielectric and piezoelectric constants of four piezoelectric materials, including polyvinylidene fluoride, vinylidene fluoride-trifluoroethylene copolymer, PZT/epoxy 1-3 composite, and lead metaniobate ceramic, have been evaluated from the impedance data using five different methods. A method described in ANSI/IEEE Std. 176-1987, though based on formulae derived for lossless materials, is found to be applicable to materials with moderate loss. However, for high-loss materials such as polyvinylidene fluoride, the electromechanical coupling constant (k[sub t]) obtained by the method of Std. 176 is substantially higher than the actual value. Calculations based on a piezoelectric resonance analysis program (PRAP) combine the best features of two earlier methods. In addition to the impedance at the parallel resonance frequency, impedances at two other frequencies are required for calculation. The PRAP method gives quite accurate material parameters regardless of the magnitude of the loss, but the parameters (including k[sub t]) vary by as much as 15% depending on the choice of data. In the nonlinear regression method described in the present work, all the impedance data points around the resonance are least-squares fitted to the theoretical expression for the impedance. Besides the advantage of requiring no arbitrary choice of data, the nonlinear regression method can readily take account of the frequency dependence of the dielectric constant.
ISSN: 0885-3010
EISSN: 1525-8955
DOI: 10.1109/58.655188
Rights: © 1997 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
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