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Title: | Large magnetostriction in epoxy-bonded Terfenol-D continuous-fiber composite with [112] crystallographic orientation | Authors: | Lo, CY Or, DSW Chan, HLW |
Issue Date: | Oct-2006 | Source: | IEEE transactions on magnetics, Oct. 2006, v. 42, no. 10, p. 3111-3113 | Abstract: | A Terfenol-D continuous-fiber composite with a preferred [112] crystallographic orientation was fabricated by embedding 50-vol% [112]-oriented Terfenol-D continuous fibers of 45 mm long and 1 mm wide in an epoxy matrix, and its magnetic and magnetostrictive properties were evaluated as a function of magnetic field. A [112]-oriented short-fiber composite with reduced Terfenol-D fiber lengths of 4 mm and a randomly oriented particulate composite with irregularly shaped Terfenol-D particles of 10-300 µm size, both with 50-vol% Terfenol-D, were also prepared and characterized for comparison with the continuous-fiber composite and monolithic Terfenol-D. The continuous-fiber composite demonstrated the largest magnetostrictive response with the highest saturation magnetostriction (λ[sub S]) of 1265 ppm. This λ[sub S] not only is 23% and 92% larger than the short-fiber and particulate composites, respectively, but also exceeds the monolithic Terfenol-D by 14%. The higher λ[sub S] compared to the monolithic Terfenol-D, short-fiber composite, and particulate composite mainly originates from the residual compressive stresses developed in the continuous fibers during epoxy cure, a higher fiber aspect ratio for greater stress transfer from the fibers to the matrix, and texturing of the fibers along the highly magnetostrictive [112] crystallographic axis, respectively. | Keywords: | [112] crystallographic orientation Domain-wall motion Fiber composites Magnetostriction Particulate composites Terfenol-D |
Publisher: | Institute of Electrical and Electronics Engineers | Journal: | IEEE transactions on magnetics | ISSN: | 0018-9464 | EISSN: | 1941-0069 | DOI: | 10.1109/TMAG.2006.878873 | Rights: | © 2006 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. |
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