Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/437
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Title: Dielectric relaxation in polyimide nanofoamed films with low dielectric constant
Authors: Zhang, Y
Ke, S
Huang, H 
Zhao, L
Yu, L
Chan, HLW 
Issue Date: 8-Feb-2008
Source: Applied physics letters, 8 May 2008, v. 92, 052910, p. 1-3
Abstract: Polyimide nanofoamed films have been prepared from the polyimide precursors (PMDA-ODA) and poly(ethylene oxide)(PEO) in N,N-dimethylacetamide. The dielectric properties of the films were studied over the temperature range of -150-150 °C and a frequency range of 1 Hz-10 MHz. The frequency dependence of the dielectric constant for nanofoamed films with different amounts of PEO was studied. An relaxation process at below the glass transition temperature of the polyimide nanofoamed films was found. The peak value of the dielectric loss increased with increasing amount of PEO.
Keywords: Dielectric losses
Dielectric relaxation
Dielectric thin films
Glass transition
Nanostructured materials
Permittivity
Polymer films
Polymer foams
Publisher: American Institute of Physics
Journal: Applied physics letters 
ISSN: 0003-6951
EISSN: 1077-3118
Rights: © 2008 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Y. Zhang et al. Appl. Phys. Lett. 92, 052910 (2008) and may be found at http://link.aip.org/link/?apl/92/052910
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