Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/132
| Title: | Complex waveform electroplating | Authors: | Chan, KC Yung, KCW Yue, TM |
Issue Date: | 19-Jul-2005 | Source: | US Patent 6,919,011 B2. Washington, DC: US Patent and Trademark Office, 2005. | Abstract: | A method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex current waveform between the anode nodes and the object. The waveform is a cyclic alternating type having two portions, a positive triangular shaped portion including one or more spikes and a negative portion. The method further includes vibrating the object and/or agitating the bath solution. | Keywords: | Waveform electroplating | Rights: | Assignee: The Hong Kong Polytechnic University. |
| Appears in Collections: | Patent |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| us6919011b2.pdf | 386.91 kB | Adobe PDF | View/Open |
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