Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/132
Title: Complex waveform electroplating
Authors: Chan, KC 
Yung, KCW 
Yue, TM 
Keywords: Waveform electroplating
Issue Date: 19-Jul-2005
Source: US Patent 6,919,011 B2. Washington, DC: US Patent and Trademark Office, 2005. How to cite?
Abstract: A method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex current waveform between the anode nodes and the object. The waveform is a cyclic alternating type having two portions, a positive triangular shaped portion including one or more spikes and a negative portion. The method further includes vibrating the object and/or agitating the bath solution.
URI: http://hdl.handle.net/10397/132
Rights: Assignee: The Hong Kong Polytechnic University.
Appears in Collections:Patent

Files in This Item:
File Description SizeFormat 
us6919011b2.pdf386.91 kBAdobe PDFView/Open
Show full item record
PIRA download icon_1.1View/Download Contents

Page view(s)

391
Last Week
0
Last month
Citations as of Aug 14, 2018

Download(s)

172
Citations as of Aug 14, 2018

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.