Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/132
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dc.contributorDepartment of Industrial and Systems Engineering-
dc.creatorChan, KC-
dc.creatorYung, KCW-
dc.creatorYue, TM-
dc.date.accessioned2008-10-30T04:58:59Z-
dc.date.available2008-10-30T04:58:59Z-
dc.identifier.urihttp://hdl.handle.net/10397/132-
dc.language.isoenen_US
dc.rightsAssignee: The Hong Kong Polytechnic University.en_US
dc.subjectWaveform electroplatingen_US
dc.titleComplex waveform electroplatingen_US
dc.typePatenten_US
dc.description.otherinformationInventor name used in this publication: Tai Men Yueen_US
dc.description.otherinformationUS6919011; US6919011 B2; US6919011B2; US6,919,011; US 6,919,011 B2; 6919011; Application No. 10/026,953en_US
dcterms.abstractA method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex current waveform between the anode nodes and the object. The waveform is a cyclic alternating type having two portions, a positive triangular shaped portion including one or more spikes and a negative portion. The method further includes vibrating the object and/or agitating the bath solution.-
dcterms.bibliographicCitationUS Patent 6,919,011 B2. Washington, DC: US Patent and Trademark Office, 2005.-
dcterms.issued2005-07-19-
dc.description.countryUS-
dc.description.oaVersion of Recorden_US
Appears in Collections:Patent
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