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http://hdl.handle.net/10397/102633
| Title: | Interfacial thermal conductance in multilayer graphene/phosphorene heterostructure | Authors: | Zhang, YY Pei, QX Mai, YW Lai, SK |
Issue Date: | 23-Nov-2016 | Source: | Journal of physics. D, Applied physics, 23 Nov. 2016, v. 49, no. 46, 465301 | Abstract: | Vertical integration of 2D materials has recently appeared as an effective method for the design of novel nano-scale devices. Using non-equilibrium molecular dynamics simulations, we study the interfacial thermal transport property of graphene/phosphorene heterostructures where phosphorene is sandwiched in between graphene. Various modulation techniques are thoroughly explored. We found that the interfacial thermal conductance at the interface of graphene and phosphorene can be enhanced significantly by using vacancy defects, hydrogenation and cross-plane compressive strain. By contrast, the reduction in the interfacial thermal conductance can be achieved by using cross-plane tensile strain. Our results provide important guidelines for manipulating the thermal transport in graphene/phosphorene based-nano-devices. | Keywords: | Interfacial thermal conductance Graphene/phosphorene heterostructures Molecular dynamics simulations Defects Strain |
Publisher: | Institute of Physics Publishing | Journal: | Journal of physics. D, Applied physics | ISSN: | 0022-3727 | EISSN: | 1361-6463 | DOI: | 10.1088/0022-3727/49/46/465301 | Rights: | © 2016 IOP Publishing Ltd This is the Accepted Manuscript version of an article accepted for publication in Journal of Physics D: Applied Physics. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/0022-3727/49/46/465301. This manuscript version is made available under the CC-BY-NC-ND 4.0 license (https://creativecommons.org/licenses/by-nc-nd/4.0/) |
| Appears in Collections: | Journal/Magazine Article |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| Lai_Interfacial_Thermal_Conductance.pdf | Pre-Published version | 1.21 MB | Adobe PDF | View/Open |
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