Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/90
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dc.contributorDepartment of Applied Physics-
dc.creatorChan, HLW-
dc.creatorChiu, SS-
dc.creatorOr, DSW-
dc.creatorCheung, YM-
dc.date.accessioned2008-10-29T08:59:50Z-
dc.date.available2008-10-29T08:59:50Z-
dc.identifier.urihttp://hdl.handle.net/10397/90-
dc.language.isoenen_US
dc.rightsAssignee: ASM Assembly Automation LTD.en_US
dc.rightsAssignee: The Hong Kong Polytechnic University.en_US
dc.subjectPiezoelectric sensoren_US
dc.subjectBonding parameters measurementen_US
dc.titlePiezoelectric sensor for measuring bonding parametersen_US
dc.typePatenten_US
dc.description.otherinformationInventor name used in this publication: Lai Wa Chan-Wongen_US
dc.description.otherinformationInventor name used in this publication: Siu Wing Oren_US
dc.description.otherinformationUS6279810; US6279810 B1; US6279810B1; US6,279,810; US 6,279,810 B1; 6279810; Application No. 09/511,707en_US
dcterms.abstractA sensor for an ultrasonic bonding apparatus comprises a piezoelectric material located between the ultrasonic transducer and an ultrasonic concentrator of the bonding apparatus. The sensor has at least two outputs for measuring different bonding parameters, the outputs being chosen to optimize the signal response for the bonding parameters in question.-
dcterms.bibliographicCitationUS Patent 6,279,810 B1. Washington, DC: US Patent and Trademark Office, 2001.-
dcterms.issued2001-08-28-
dc.description.countryUS-
dc.description.oaVersion of Recorden_US
Appears in Collections:Patent
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