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|Title:||Method of laser joining of dissimilar materials with ultrasonic aid||Authors:||Chen, Y
|Issue Date:||5-May-2020||Source:||US Patent 10,639,744 B2. Washington, DC: US Patent and Trademark Office, 2020.||Abstract:||A new ultrasonic aided laser joining method (UAL) for bonding dissimilar materials has been developed. The method is capable of eliminating the laser-induced bubbles at the bonding faces and to improve the joint strength over that of the conventional laser-assisted metal and plastic joining method (LAMP). Some experiments on joining titanium to polyethylene terephthalate have been conducted to show the superiority of UAL over LAMP. The results showed that the joint strength, measured in terms of failure load, was significantly increased when ultrasonic vibration was employed during laser joining. For the LAMP joined specimens, fracture normally occurred at the metal-plastic interface, whereas for the UAL joined specimens, fracture normally occurred in the parent plastic part. The improvement in joint strength is mainly due to the elimination of pores in the resolidified plastic. In addition, ultrasound vibration promotes chemical bonding between the plastic and metal parts, and this is supported by the XPS results.||Rights:||Assignee: The Hong Kong Polytechnic University.
Assignee: Guangdong University of Technology
|Appears in Collections:||Patent|
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