Conformal circuit and preparation method therefor

Abstract

The invention provides a conformal circuit and a preparation method therefor. The preparation method for the conformal circuit comprises the following steps of S1, irradiating a substrate by laser to form a circuit structure on the substrate; S2, immersing the substrate in a chemical copper-plating solution to plate the circuit structure with copper, wherein the substrate comprises a laser processing layer, and the circuit structure is formed on the laser processing layer; the step S1 also a step of preparing the laser processing layer; the preparation of the laser processing layer comprises a step S11a or a step S11b, wherein the step S11a is as follows: mixing oxidizing agent and plastic into a solvent to form a mixture; and then evaporating the solvent in the mixture so as to form the laser processing layer; and the step S11b is as follows: uniformly mixing the oxidizing agent, epoxy resin, a hardening agent and acetone to form epoxy resin coating; and then curing the epoxy resin coating so as to form the laser processing layer. The conformal circuit produced by the invention is more flexible in design and higher in production efficiency. 本发明提出了一种共形电路及其制备方法；所述共形电路的制备方法包括以下步骤：步骤S1、采用激光对衬底进行照射，使衬底上形成电路结构；步骤S2、将衬底沉渍在化学镀铜液中，使电路结构上镀有铜；所述衬底包括激光处理层；所述电路结构形成于该激光处理层上；所述步骤S1还包括激光处理层的制备步骤；激光处理层的制备步骤为步骤S11a或步骤S11b；其中，步骤S11a为：将氧化剂、塑料混于溶剂中，以形成混合物；再将该混合物中的溶剂蒸发，从而形成激光处理层；步骤S11b为：将氧化剂、环氧树脂、硬化剂以及丙酮混合均匀，以形成环氧树脂涂料；然后将该环氧树脂涂料固化，从而形成激光处理层。本发明生产的共形电路设计更灵活、生产更有效率。