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Title: Accelerating 3d printing process using an extended ant colony optimization algorithm
Authors: Fok, KY 
Cheng, CT 
Ganganath, N
Tse, CK 
Issue Date: 2018
Source: 2018 International Symposium on Circuits and Systems (ISCAS), Florence, Italy, 27-30 May 2018, p. 1-5
Abstract: Ant colony optimization (ACO) algorithms have been widely adopted in solving combinatorial problems, like the traveling salesman problem (TSP). Nevertheless, with a proper transformation to TSP, ACO is capable of solving undirected rural postman problems (URPP) as well. In fact, nozzle path planning problems in 3D printing can be represented as URPP. Therefore, in this work, ACO is utilized as a URPP solver to accelerate the printing process in fused deposition modeling applications. Furthermore, mechanisms which exploit unique properties in 3D models are proposed to further extend the ACO in the above optimization process. These mechanisms are capable of accelerating ACO by adaptively adjusting its number of iterations on-the-fly. Simulation results using real-life 3D models show that the proposed extensions can accelerate ACO without affecting the quality of its solutions significantly.
Keywords: Ant colony optimization
Additive manufacturing
3D printing
Undirected rural postman proble
Publisher: Institute of Electrical and Electronics Engineers
ISBN: 978-1-5386-4881-0 (electronic)
978-1-5386-4882-7 (print on demand(PoD))
EISSN: 2379-447X
DOI: 10.1109/ISCAS.2018.8351113
Rights: © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
The following publication Fok, K. Y., Cheng, C. T., Ganganath, N., Iu, H. H. C., & Chi, K. T. (2018, May). Accelerating 3D Printing Process Using an Extended Ant Colony Optimization Algorithm. In 2018 IEEE International Symposium on Circuits and Systems (ISCAS) (pp. 1-5). IEEE is available at
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