Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/7658
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dc.contributorDepartment of Electrical Engineering-
dc.creatorCheng, KWE-
dc.creatorWong, YW-
dc.creatorWu, WT-
dc.creatorDing, K-
dc.creatorHo, YL-
dc.creatorCheung, TK-
dc.creatorCheong, CK-
dc.date.accessioned2015-10-27T00:44:31Z-
dc.date.available2015-10-27T00:44:31Z-
dc.identifier.urihttp://hdl.handle.net/10397/7658-
dc.language.isoenen_US
dc.rightsAssignee: The Hong Kong Polytechnic University.en_US
dc.titlePolymer-bonded magnetic materialsen_US
dc.typePatenten_US
dc.description.otherinformationUS8277678; US8277678 B2; US8277678B2; US8,277,678; US 8,277,678 B2; 8277678; Appl. No. 12/039,592en_US
dc.description.otherinformationInventor name used in this publication: Ka Wai Eric Chengen_US
dc.description.otherinformationInventor name used in this publication: Chi Keong Cheongen_US
dcterms.abstractA magnetic composition for power conversion includes a thermoplastic polymer and magnetic powders. The composition has a tensile strength of greater than 20 N/mm².-
dcterms.bibliographicCitationUS Patent 8,277,678 B2. Washington, DC: US Patent and Trademark Office, 2012.-
dcterms.issued2012-10-02-
dc.description.countryUS-
dc.description.oaVersion of Recorden_US
Appears in Collections:Patent
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