Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/68418
DC Field | Value | Language |
---|---|---|
dc.contributor | Department of Industrial and Systems Engineering | - |
dc.creator | Chan, KC | - |
dc.creator | Yung, KC | - |
dc.creator | Yue, TM | - |
dc.date.accessioned | 2017-08-22T05:54:59Z | - |
dc.date.available | 2017-08-22T05:54:59Z | - |
dc.identifier.uri | http://hdl.handle.net/10397/68418 | - |
dc.language.iso | en | en_US |
dc.rights | Assignee: The Hong Kong Polytechnic Univeristy. | en_US |
dc.title | Complex waveform electroplating | en_US |
dc.type | Patent | en_US |
dc.description.otherinformation | US6919011; US6919011 B2; US6919011B2; US6,919,011; US 6,919,011 B2; 6919011; Appl. No. 10/026,953 | en_US |
dcterms.abstract | A method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex current waveform between the anode nodes and the object. The waveform is a cyclic alternating type having two portions, a positive triangular shaped portion including one or more spikes and a negative portion. The method further includes vibrating the object and/or agitating the bath solution. | - |
dcterms.bibliographicCitation | US Patent 6,919,011 B2. Washington, DC: US Patent and Trademark Office, 2005. | - |
dcterms.issued | 2005-07-19 | - |
dc.description.country | US | - |
dc.identifier.rosgroupid | r25847 | - |
dc.description.ros | 2005-2006 > Other Outputs > Patents granted | - |
dc.description.oa | Version of Record | en_US |
Appears in Collections: | Patent |
Files in This Item:
File | Description | Size | Format | |
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us6919011b2.pdf | 356.23 kB | Adobe PDF | View/Open |
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