Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/6296
DC Field | Value | Language |
---|---|---|
dc.contributor | Department of Industrial and Systems Engineering | - |
dc.contributor | Research Institute of Innovative Products and Technologies | - |
dc.creator | Cheng, CH | - |
dc.creator | Chao, C | - |
dc.date.accessioned | 2014-01-14T07:45:54Z | - |
dc.date.available | 2014-01-14T07:45:54Z | - |
dc.identifier.uri | http://hdl.handle.net/10397/6296 | - |
dc.language.iso | en | en_US |
dc.rights | Assignee: The Hong Kong Polytechnic University. | en_US |
dc.title | Flexible capacitive micromachined ultrasonic transducer array with increased effective capacitance | en_US |
dc.type | Patent | en_US |
dc.description.otherinformation | US8531919; US8531919 B2; US8531919B2; US8,531,919; US 8,531,919 B2; 8531919; Appl. No. 12/885,798 | en_US |
dcterms.abstract | A Capacitive Micromachined Ultrasonic Transducer (CMUT) having a membrane operatively connected to a top electrode and having a bottom electrode having a concave void. When a DC bias voltage is applied, the membrane is deflected towards the bottom electrode such that a peripheral edge region of the membrane is brought into close proximity with the bottom electrode and an electrostatic force proximal to the peripheral edge region of the membrane is increased. | - |
dcterms.bibliographicCitation | US Patent 8,531,919 B2. Washington, DC: US Patent and Trademark Office, 2013. | - |
dcterms.issued | 2013-09-10 | - |
dc.description.country | US | - |
dc.description.oa | Version of Record | en_US |
Appears in Collections: | Patent |
Files in This Item:
File | Description | Size | Format | |
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us8531919b2.pdf | 1.12 MB | Adobe PDF | View/Open |
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