Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/2463
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dc.contributorDepartment of Applied Physics-
dc.creatorChan, HLW-
dc.creatorLam, TY-
dc.creatorChao, C-
dc.creatorKwok, KW-
dc.date.accessioned2010-12-08T07:04:33Z-
dc.date.available2010-12-08T07:04:33Z-
dc.identifier.urihttp://hdl.handle.net/10397/2463-
dc.language.isoenen_US
dc.rightsAssignee: The Hong Kong Polytechnic University.en_US
dc.titleMethod and apparatus for measuring oscillation amplitude of an ultrasonic deviceen_US
dc.typePatenten_US
dc.description.otherinformationUS7819013; US7819013 B2; US7819013B2; US7,819,013; US 7,819,013 B2; 7819013; Appl. No. 11/481,205en_US
dc.description.otherinformationInventor name used in this publication: Helen Lai Wa Chanen_US
dc.description.otherinformationInventor name used in this publication: Tin Yan Lamen_US
dc.description.otherinformationInventor name used in this publication: Kin Wing Kwoken_US
dcterms.abstractAn apparatus and method for detecting the oscillation amplitude of a bonding tool includes a sensing unit disposed adjacent to and at a distance from the bonding tool. The sensing unit includes a pair of electrodes, a piezoelectric sensing layer located between the pair of electrodes, and a membrane associated with the piezoelectric sensing layer. The piezoelectric sensing layer becomes sensitive to ultrasonic vibrations and generates electrical voltage signals after being activated by a poling process. An optional pre-amplifier is used to amplify the signals generated from the sensing unit, and an oscilloscope is used to further process the signals.-
dcterms.bibliographicCitationUS Patent 7,819,013 B2. Washington, DC: US Patent and Trademark Office, 2010.-
dcterms.issued2010-10-26-
dc.description.countryUS-
dc.description.oaVersion of Recorden_US
Appears in Collections:Patent
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