Please use this identifier to cite or link to this item:
PIRA download icon_1.1View/Download Full Text
Title: Method of drilling a circuit board
Authors: Yung, KCW 
Yue, TM 
Fang, XY
Issue Date: 26-Oct-2004
Source: US Patent 6,809,289 B2. Washington, DC: US Patent and Trademark Office, 2004.
Abstract: A circuit board comprising a dielectric material provided with a conductive layer is drilled with laser operated at an energy density below the ablation threshold of the conductive layer. The method of drilling includes providing on the conductive layer an ablation layer having an ablation threshold near or below that laser energy density, directing the laser at a target area of the ablation layer to ablate portions of the conductive and dielectric layers in the target area, and removing any remaining ablation layer from the conductive layer.
Keywords: Circuit board drilling
Rights: Assignee: The Hong Kong Polytechnic University.
Appears in Collections:Patent

Files in This Item:
File Description SizeFormat 
us6809289b2.pdf340.87 kBAdobe PDFView/Open
Show full item record

Page views

Last Week
Last month
Citations as of Jun 4, 2023


Citations as of Jun 4, 2023

Google ScholarTM


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.