Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/1330
| DC Field | Value | Language |
|---|---|---|
| dc.contributor | Department of Applied Physics | - |
| dc.creator | Chan, HLW | - |
| dc.creator | Or, DSW | - |
| dc.creator | Cheng, KC | - |
| dc.creator | Choy, CL | - |
| dc.date.accessioned | 2009-08-25T07:07:42Z | - |
| dc.date.available | 2009-08-25T07:07:42Z | - |
| dc.identifier.uri | http://hdl.handle.net/10397/1330 | - |
| dc.language.iso | en | en_US |
| dc.rights | Assignee: The Hong Kong Polytechnic University. | en_US |
| dc.subject | Ultrasonic transducers | en_US |
| dc.subject | Bonding tool | en_US |
| dc.title | Ultrasonic transducer | en_US |
| dc.type | Patent | en_US |
| dc.description.otherinformation | US6190497; US6190497 B1; US6190497B1; US6,190,497; US 6,190,497 B1; 6190497; Application No. 09/296,801 | en_US |
| dc.description.otherinformation | Inventor name used in this publication: Helen Lai Wa Chan | en_US |
| dc.description.otherinformation | Inventor name used in this publication: Siu Wing Or | en_US |
| dc.description.otherinformation | Inventor name used in this publication: Chung Loong Choy | en_US |
| dcterms.abstract | A bonding tool for applying pressure and ultrasonic energy simultaneously to join miniature components together includes an ultrasonic driver having four composite wafers separated by electrodes. Such bonding tools are known that use wafers made of wholly of ceramic material. By using wafers having four sector parts of ceramic material separated by layers of polymer as shown, bonding tools are provided with broader bandwidth operation and reduced spurious resonance modes. | - |
| dcterms.bibliographicCitation | US Patent 6,190,497 B1. Washington, DC: US Patent and Trademark Office, 2001. | - |
| dcterms.issued | 2001-02-20 | - |
| dc.description.country | US | - |
| dc.description.oa | Version of Record | en_US |
| Appears in Collections: | Patent | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| us6190497b1.pdf | 198.41 kB | Adobe PDF | View/Open |
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