Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/1330
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dc.contributorDepartment of Applied Physics-
dc.creatorChan, HLW-
dc.creatorOr, DSW-
dc.creatorCheng, KC-
dc.creatorChoy, CL-
dc.date.accessioned2009-08-25T07:07:42Z-
dc.date.available2009-08-25T07:07:42Z-
dc.identifier.urihttp://hdl.handle.net/10397/1330-
dc.language.isoenen_US
dc.rightsAssignee: The Hong Kong Polytechnic University.en_US
dc.subjectUltrasonic transducersen_US
dc.subjectBonding toolen_US
dc.titleUltrasonic transduceren_US
dc.typePatenten_US
dc.description.otherinformationUS6190497; US6190497 B1; US6190497B1; US6,190,497; US 6,190,497 B1; 6190497; Application No. 09/296,801en_US
dc.description.otherinformationInventor name used in this publication: Helen Lai Wa Chanen_US
dc.description.otherinformationInventor name used in this publication: Siu Wing Oren_US
dc.description.otherinformationInventor name used in this publication: Chung Loong Choyen_US
dcterms.abstractA bonding tool for applying pressure and ultrasonic energy simultaneously to join miniature components together includes an ultrasonic driver having four composite wafers separated by electrodes. Such bonding tools are known that use wafers made of wholly of ceramic material. By using wafers having four sector parts of ceramic material separated by layers of polymer as shown, bonding tools are provided with broader bandwidth operation and reduced spurious resonance modes.-
dcterms.bibliographicCitationUS Patent 6,190,497 B1. Washington, DC: US Patent and Trademark Office, 2001.-
dcterms.issued2001-02-20-
dc.description.countryUS-
dc.description.oaVersion of Recorden_US
Appears in Collections:Patent
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