Microelectronic yarn fabric and manufacturing method

Abstract

The invention provides a microelectronic yarn fabric. The microelectronic yarn fabric comprises: an underlying substrate; a microelectronic yarn disposed on the underlying substrate; an electronic chip which is arranged on the microelectronic yarn and is electrically connected with the microelectronic yarn; and a preposed soft buckle which is arranged on the underlying substrate and comprises a control unit, wherein the preposed soft buckle is electrically connected with the microelectronic yarn. The microelectronic yarn fabric disclosed by the invention has relatively high flexibility and expansibility. 本公开提供了一种微电子纱织物。该微电子纱织物包括：底层基底；微电子纱，布置在所述底层基底上；电子芯片，布置在所述微电子纱上，所述电子芯片与所述微电子纱电连接；以及前置软扣，布置在所述底层基底上，包括控制单元，所述前置软扣与所述微电子纱电连接。本公开的微电子纱织物具有较高的柔韧性与扩展性。