Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/132
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Title: Complex waveform electroplating
Authors: Chan, KC 
Yung, KCW 
Yue, TM 
Issue Date: 19-Jul-2005
Source: US Patent 6,919,011 B2. Washington, DC: US Patent and Trademark Office, 2005.
Abstract: A method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex current waveform between the anode nodes and the object. The waveform is a cyclic alternating type having two portions, a positive triangular shaped portion including one or more spikes and a negative portion. The method further includes vibrating the object and/or agitating the bath solution.
Keywords: Waveform electroplating
Rights: Assignee: The Hong Kong Polytechnic University.
Appears in Collections:Patent

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