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Title: Modeling of epoxy dispensing process using a hybrid fuzzy regression approach
Authors: Chan, KY
Kwong, CK 
Keywords: Electronic packaging
Epoxy dispensing
Evolutionary computation
Fuzzy regression
Genetic programming
Microchip encapsulation
Process modeling
Semiconductor manufacturing
Issue Date: 2013
Publisher: Springer
Source: International journal of advanced manufacturing technology, 2013, v. 65, no. 1-4, p. 589-600 How to cite?
Journal: International journal of advanced manufacturing technology 
Abstract: In the semiconductor manufacturing industry, epoxy dispensing is a popular process commonly used in die-bonding as well as in microchip encapsulation for electronic packaging. Modeling the epoxy dispensing process is important because it enables us to understand the process behavior, as well as determine the optimum operating conditions of the process for a high yield, low cost, and robust operation. Previous studies of epoxy dispensing have mainly focused on the development of analytical models. However, an analytical model for epoxy dispensing is difficult to develop because of its complex behavior and high degree of uncertainty associated with the process in a real-world environment. Previous studies of modeling the epoxy dispensing process have not addressed the development of explicit models involving high-order and interaction terms, as well as fuzziness between process parameters. In this paper, a hybrid fuzzy regression (HFR) method integrating fuzzy regression with genetic programming is proposed to make up the deficiency. Two process models are generated for the two quality characteristics of the process, encapsulation weight and encapsulation thickness based on the HFR, respectively. Validation tests are performed. The performance of the models developed based on the HFR outperforms the performance of those based on statistical regression and fuzzy regression.
ISSN: 0268-3768
EISSN: 1433-3015
DOI: 10.1007/s00170-012-4202-4
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