Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/9178
Title: Dielectric and thermal properties of polyimide-poly(ethylene oxide) nanofoamed films
Authors: Zhang, YH
Yu, L
Zhao, LH
Tong, WS
Huang, HT 
Ke, SM
Chan, HLW 
Keywords: Composites
Dielectric properties
Thermal properties
Thin films
Issue Date: 2012
Source: Journal of electronic materials, 2012, v. 41, no. 8, p. 2281-2285 How to cite?
Journal: Journal of Electronic Materials 
Abstract: Polyimide nanofoamed films have been prepared by incorporating poly(ethylene oxide) (PEO) into poly(amide acid) (PAA) precursors with subsequent imidization of PAA precursors at high temperature. The porous structure, thermal decomposition temperature, and dielectric property of nanofoamed films were investigated by scanning electron microscopy, thermogravimetric analysis, and impedance spectroscopy. Nanopores with sizes around 40 nm to 200 nm were formed in nanofoamed films by pyrolysis of PEO during the imidization progress. The decomposition temperature of nanofoamed films decreased slightly with increasing volume fraction of nanopores and maintained the high decomposition temperature of 499.7 C when the volume fraction of nanopores was 10.9 %. The dielectric constant of nanofoamed films decreased from 3.4 for pure PI to 2.4 at 103 Hz through the introduction of nanopores with volume fraction of 10.9 %.
URI: http://hdl.handle.net/10397/9178
ISSN: 0361-5235
DOI: 10.1007/s11664-012-2037-2
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