Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/9161
Title: Thermal investigation and placement design of high-brightness LED array package on PCB for uniform illuminance
Authors: Yung, KC 
Liem, H
Choy, HS
Lun, WK
Keywords: LED array
Light-emitting diode
Printed circuit board
Thermal modeling
Issue Date: 2011
Publisher: Asme-Amer Soc Mechanical Eng
Source: Journal of electronic packaging, transactions of the asme, 2011, v. 133, no. 1, 11006 How to cite?
Journal: Journal of Electronic Packaging, Transactions of the ASME 
Abstract: This paper reports the thermal performance of a high-brightness light-emitting diode (LED) array package with a novel placement method on a printed circuit board (PCB). The precise heat transfer analysis and modeling using computational fluid dynamics (CFD) were performed according to the practical working conditions of the LED array. Emphasis was placed upon investigating how the temperature of the surface of LEDs changed in accordance with different placement methods. A significant drop in the surface temperature of the LEDs was found when the triangular and arithmetic spacing placement methods were used; hence, the overall heat dissipating capability of the LED array to the PCB was improved. By optimizing the placement design, the average surface temperature of the LED array achieved a decrease of about 20%, from 120?XC to 100?XC. The illuminance level of e
URI: http://hdl.handle.net/10397/9161
ISSN: 1043-7398
DOI: 10.1115/1.4003514
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