Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/87457
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dc.contributorInstitute of Textiles and Clothingen_US
dc.creatorTan, Jen_US
dc.date.accessioned2020-07-08T06:17:50Z-
dc.date.available2020-07-08T06:17:50Z-
dc.identifier.isbn978-962-367-834-6 (Exhibition catalog)en_US
dc.identifier.urihttp://hdl.handle.net/10397/87457-
dc.descriptionFast evolving contemporary lifestyles see a demand for design and technology integrated products that can seamlessly integrate into everyday life to enhance well- being. Innovations emerge from the bridging of design and technology creating a symbiotic relationship between creatives and engineers. Designing for the future will involve working collaboratively across disciplines as life, work and well- being boundaries are blurred. In the summer of 2019, Designing Future Techstyle 2019 brought together the world’s top design academics, cutting edge practitioners and innovative young designers to set agendas representing the designers’ perspectives and foster creativity in the context of design-led technology for social good. The event includes 4 activities: symposium, international competition, workshops and travelling exhibitions. Designing Future Techstyle 2019 provided a platform for active discussions, explorations and the fostering of an interdisciplinary creative atmosphere. The variety of activities creating vital opportunities for international and local communities to engage. The event attracted over 400,000 participants across all events during June-September 2019.en_US
dc.descriptionDesigning Future Techstyle is the recepient of external funding from the Create Smart Initiative (CSI(D)/1808/0259)en_US
dc.descriptionExhibition period: June - September 2019en_US
dc.descriptionVenue: The Mills, Hong Kongen_US
dc.language.isoenen_US
dc.publisherHong Kong Polytechnic Universityen_US
dc.titleDesigning future techstyleen_US
dc.typeExhibitionen_US
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitation[Exhibition catalog]- Tan, J. Designing future techstyle. Hong Kong: Hong Kong Polytechnic University, 2019en_US
dcterms.issued2019-
dc.description.validate202007 bcmaen_US
dc.description.oaVersion of Recorden_US
dc.identifier.FolderNumbera0442-n01en_US
dc.description.pubStatusPublisheden_US
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