Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/8684
Title: Study on the dielectric properties of hybrid and porous polyimide-silica films
Authors: Zhang, Y
Su, Q
Yu, L
Zheng, H
Huang, H 
Zhang, G
Yao, Y
Chan, HLW 
Keywords: Dielectric constant
Polyimide
Porous and hybrid film
Silica
Issue Date: 2008
Publisher: Scientific.Net
Source: Advanced materials research, 2008, v. 47-50 PART 2, p. 973-976 How to cite?
Journal: Advanced materials research 
Abstract: A sol-gel process was used to prepare polyimide-silica hybrid films from the polyimide precursors and TEOS in N,N- dimethyl acetamide, then the hybrid film was treated with hydrofluoric acid to remove the dispersed silica particles, leaving pores with diameters between 80nm to 1 μm, depending on the size of silica particles. The structure and dielectric constant of the hybrid and porous films were characterized by FTIR,SEM. The porous films displayed relatively low dielectric constant compared to the hybrid polyimide-silica films.
Description: Multi-functional Materials and Structures - International Conference on Multifunctional Materials and Structures, Hong Kong, P.R., 28-31 July 2008
URI: http://hdl.handle.net/10397/8684
ISBN: 0878493786
9780878493784
ISSN: 1022-6680
EISSN: 1662-8985
Appears in Collections:Conference Paper

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