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Title: Study on the dielectric properties of hybrid and porous polyimide-silica films
Authors: Zhang, Y
Su, Q
Yu, L
Zheng, H
Huang, H 
Zhang, G
Yao, Y
Chan, HLW 
Issue Date: 2008
Source: Advanced materials research, 2008, v. 47-50 PART 2, p. 973-976
Abstract: A sol-gel process was used to prepare polyimide-silica hybrid films from the polyimide precursors and TEOS in N,N- dimethyl acetamide, then the hybrid film was treated with hydrofluoric acid to remove the dispersed silica particles, leaving pores with diameters between 80nm to 1 μm, depending on the size of silica particles. The structure and dielectric constant of the hybrid and porous films were characterized by FTIR,SEM. The porous films displayed relatively low dielectric constant compared to the hybrid polyimide-silica films.
Keywords: Dielectric constant
Porous and hybrid film
Publisher: Scientific.Net
Journal: Advanced materials research 
ISBN: 0878493786
ISSN: 1022-6680
EISSN: 1662-8985
Description: Multi-functional Materials and Structures - International Conference on Multifunctional Materials and Structures, Hong Kong, P.R., 28-31 July 2008
Appears in Collections:Conference Paper

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