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Title: High velocity pseudo-SAWs on CVD diamond substrate
Authors: Chong, N
Chan, HLW 
Kwok, KP
Choy, CL 
Issue Date: 2001
Source: Asia-Pacific Microwave Conference Proceedings, APMC, 2001, v. 1, p. 334-337 How to cite?
Abstract: In recent years high frequency SAW devices for GHz range telecommunication applications have been demonstrated using multilayer structures containing a high velocity CVD diamond thin-film on silicon substrate. Despite a theoretical sound velocity of diamond approaching 18000 m/s, the silicon substrate considerably increases the propagation loss and prohibits the high velocity modes to be effectively used, unless the diamond thin-film is thick compared with acoustic wavelengths or a submicron lithography is involved. Instead of growing diamond thin-film on silicon substrate, this work reports a delay-line structure fabricated with ZnO thin-film on a thick CVD diamond substrate (380 μm). A high velocity pseudo-SAWs (HVPSAWs) mode in excess of 15000 m/s with a propagation loss less than 0.58 dB/λ was observed. The device structure allows an investigation of high-velocity and low-coupling propagation modes for SAWs.
Description: 2001 Asia-Pacific Microwave Conference, Taipei, 3-6 December 2001
ISBN: 0-7803-7138-0
Appears in Collections:Conference Paper

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