Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/8486
Title: Fuzzy regression approach to process modelling and optimization of epoxy dispensing
Authors: Kwong, CK 
Bai, H
Keywords: Process modelling
Process optimization
Fuzzy regression
Fuzzy optimization
Epoxy dispensing
Issue Date: 2005
Publisher: Taylor & Francis
Source: International journal of production research, 2005, v. 43, no. 12, p. 2359-2375 How to cite?
Journal: International journal of production research 
Abstract: Epoxy dispensing is one of the popular processes to perform microchip encapsulation for chip-on-board (COB) packages. However, determination of proper process parameters setting for optimal quality of the encapsulation is difficult due to the complex behaviour of the encapsulant during dispensing and the uncertainties caused by fuzziness of epoxy dispensing systems. In conventional regression models, deviations between the observed values and the estimated values are supposed to be in probability distribution. However, when data is irregular, the obtained regression model has an unnaturally wide possibility range. In fact, these deviations in some processes such as epoxy dispensing can be regarded as system fuzziness that can be dealt with properly using fuzzy regression method. In this paper, a fuzzy regression approach with fuzzy intervals to process modelling of epoxy dispensing for microchip encapsulation is described. Two fuzzy regression models relating three process parameters and two quality characteristics respectively for epoxy dispensing were developed. They were then introduced to formulate a fuzzy multi-objective optimization problem. A fuzzy linear programming technique was employed to formulate the optimization model. By solving the model, an optimal setting of process parameters can be obtained. Validation experiments were conducted to evaluate the effectiveness of the proposed approach to process modelling and optimization of epoxy dispensing for microchip encapsulation.
URI: http://hdl.handle.net/10397/8486
ISSN: 0020-7543
EISSN: 1366-588X
DOI: 10.1080/00207540500046137
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