Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/8434
Title: Piezocomposite ultrasonic transducer for high-frequency wire-bonding of microelectronics devices
Authors: Or, SW 
Chan, HLW 
Liu, PCK
Keywords: Finite-element analysis
Mechanical quality factor
Microelectronics devices
Mode coupling
Piezocomposites
Ultrasonic transducers
Ultrasonic wire bonding
Issue Date: 2007
Publisher: Elsevier
Source: Sensors and actuators. A, Physical, 2007, v. 133, no. 1, p. 195-199 How to cite?
Journal: Sensors and actuators. A, Physical 
Abstract: Piezocomposite ultasonic transducers for high-frequency microelectronics wire bonding have been developed to alleviate the intrinsic mode coupling and high mechanical quality factor (Qm) in piezoceramic transducers. In this paper, a 136 kHz transducer fabricated using lead zirconate titanate (PZT)/epoxy 1-3 piezocomposite rings with 77 μm epoxy width and 0.89 PZT volume fraction is presented, together with a PZT piezoceramic transducer of similar structure. With the guide of a finite-element modal analysis, the nature of most experimental resonance modes in the transducers is identified. The low lateral coupling of the composite rings effectively suppresses the non-axial and many other spurious resonances in the composite transducer, retaining only the axial-mode resonances. Due to the effect of epoxy damping, the composite transducer exhibits a 2.4-times reduction in Qm to a desired low value of 296. This transducer has good potential to be used in commercial wire bonders for enabling high-frequency wire-bonding technology.
URI: http://hdl.handle.net/10397/8434
ISSN: 0924-4247
EISSN: 1873-3069
DOI: 10.1016/j.sna.2006.03.018
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