Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/8418
Title: Dielectric properties and relaxation behavior of polymethylsiloxane-imide films
Authors: Wang, H
Tao, X 
Newton, E
Keywords: Dielectric relaxation behavior
Electric conduction and kinetic characteristics
Low dielectric constant
Polysiloxane-imide
Issue Date: 2003
Source: High performance polymers, 2003, v. 15, no. 1, p. 91-103 How to cite?
Journal: High Performance Polymers 
Abstract: We have investigated the dielectric properties, dielectric relaxation behavior, electric conduction and kinetic characteristics of polysiloxane-imide films. The addition of siloxane is a very effective way to reduce the dielectric constant (ε′) of polyimides. For example, polysiloxane-imide [BPDA + siloxane] has a very low dielectric constant of 2.66, compared to normal polyimides such as Upilex-S [BPDA + p-PDA] with a dielectric constant of 3.47. The dielectric relaxation behavior of polysiloxane-imide is quite similar to that of fluorine-containing polysiloxane-imide. As frequency increases, the transition peaks of polysiloxane-imide move toward high temperature and the α relaxation strengths decrease. The β peak corresponds to the β dipolar relaxation whereas the α peak is due to the conductive effects in the bulk and the α dipolar relaxation. The activation energy of the α transition decreases with increasing frequency, while the activation energy of the β transition does not vary with frequency. The α peak is reduced with the increase of frequency, while the value of the β peak hardly changes with frequency.
URI: http://hdl.handle.net/10397/8418
ISSN: 0954-0083
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