Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/82087
PIRA download icon_1.1View/Download Full Text
Title: Two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and preparation method for same
Other Title: 基于三维超声成像的二维阵列超声换能器及其制备方法
Authors: Dai, J 
Fang, H 
Huang, ZW 
Chen, Y 
Issue Date: 17-Jul-2018
Source: 中国专利 ZL 201410617359.3
Abstract: The invention relates to the technical field of three-dimensional ultrasonic imaging and discloses a two-dimensional array ultrasonic transducer based on the three-dimensional ultrasonic imaging and a preparation method for the same. The two-dimensional array ultrasonic transducer comprises an insulated resin frame, an electric-conduction backer board, a piezoelectric plate and a printing circuit board, wherein N*N hollow channels filled with an electric-conduction adhesive are formed in the insulated resin frame; the electric-conduction backer board is disposed on the insulated resin frame; the piezoelectric plate is located on the electric-conduction backer board and comprises N*N piezoelectric array elements; and N*N array row pins which are correspondingly disposed in the N*N hollow channels respectively are disposed on the printing circuit board. By the electric-conduction adhesive, the piezoelectric array elements are electrically connected to the array row pins, so that the problem in complex wiring technologies of the array elements of the two-dimensional ultrasonic transducer is solved, and preparation cost is reduced. Meanwhile, the short-circuited problem happening when an interval between every two piezoelectric array elements is too small during wiring is avoided. In addition, the electric-conduction backer board can absorb useless sound waves on the back face of the piezoelectric plate, so that quality of the two-dimensional array ultrasonic transducer can be improved greatly.
本发明涉及三维超声成像的技术领域,公开了基于三维超声成像的二维阵列超声换能器及其制备方法,二维阵列超声换能器包括绝缘树脂框架、导电背衬板、压电片以及印刷电路板,绝缘树脂框架中具有NxN个填充导电胶的空心通道;导电背衬板设于绝缘树脂框架上;压电片置于导电背衬板上,其中具有NxN个压电阵元;印刷电路板上设有NxN个分别对应置于NxN个所述空心通道中的阵列排针。通过导电胶,将压电阵元与阵列排针电性连接,解决二维阵列超声换能器的阵元复杂的接线工艺,降低制备成本,同时,在接线过程中,由于各压电阵元之间间距过小,避免出现短路的问题;另外,导电背衬板可以吸收压电片背面的无用声波,大大提高二维阵列超声换能器的品质。
Publisher: 中华人民共和国国家知识产权局
Rights: 专利权人: 香港理工大学深圳研究院
Appears in Collections:Patent

Files in This Item:
File Description SizeFormat 
ZL201410617359.3.pdf616.55 kBAdobe PDFView/Open
Show full item record

Page views

70
Last Week
1
Last month
Citations as of Mar 24, 2024

Downloads

34
Citations as of Mar 24, 2024

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.