Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/82068
Title: Local bridge damage quantification method based on deflection influence lines
Other Title: 一种基于挠度影响线的桥梁局部损伤量化方法
Authors: Chen, Z
Zhu, S 
Cai, Q
Issue Date: 2018
Source: 中国专利 ZL 201610519967.X
Abstract: The invention discloses a local bridge damage quantification method based on deflection influence lines and relates to the field of health monitoring of an engineering structure. The method comprises steps as follows: 1) decomposition and combination of an eigenvalue of a stiffness matrix; 2) construction of an influence line matrix; 3) quantification of the injury degree. By means of a characteristic parameter decomposition method, damage is quantified by the use of the influence lines, a matrix with similar sensitivity is acquired more conveniently, the solving process cannot be iterated, and the solving speed is higher. On the basis of the deflection influence lines of a bridge, the damage degree can be more accurately quantified while local damage is positioned. Compared with existing damage indexes, the damage index based on the influence lines is more sensitive to local damage of the bridge and is not sensitive to change of the environment factor, and the method is more suitable for detecting the local damage of the bridge in the operation environment. Compared with a conventional damage positioning method based on a sensitivity matrix, the matrix with the similar sensitivity is simpler and more convenient to construct, the solving process cannot be iterated, the problem about no convergence of iteration of numerical solution is solved, and the solving speed is increased.
一种基于挠度影响线的桥梁局部损伤量化方法,涉及工程结构健康监测领域。包括以下步骤:1)刚度矩阵的特征值分解与组合:2)影响线矩阵的构造;3)损伤程度的量化。通过特征参数分解的方法利用影响线对损伤进行量化,获得类似灵敏度的矩阵更方便,求解过程可不迭代,求解速度更快。基于桥梁挠度影响线,可实现对局部损伤定位的同时,更能准确量化损伤程度。同现有损伤指标相比,基于影响线的损伤指标对桥梁局部损伤更敏感,而对环境因素变化不敏感,较适用于在运营环境下检测桥梁的局部损伤。相比传统基于灵敏度矩阵的损伤定位方法,类似灵敏度矩阵的构造更简单方便,求解过程可不迭代,避免数值求解的迭代不收敛问题,并且提高了求解速度。
Publisher: 中华人民共和国国家知识产权局
Rights: 专利权人: 厦门大学
专利权人: 香港理工大学
Appears in Collections:Patent

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