Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/8149
Title: Pursuit of future interconnect technology with aligned carbon nanotube arrays
Authors: Chai, Y
Sun, M
Xiao, Z
Li, Y
Zhang, M
Chan, PCH 
Issue Date: 2011
Source: IEEE Nanotechnology magazine, 2011, v. 5, no. 1, 5716833, p. 22-26 How to cite?
Journal: IEEE Nanotechnology Magazine 
Abstract: As the Feature size of interconnect technology continues to scale down to nanometer sizes, the state-of-the-art Cu interconnect is expected to run into its physical limit in the near future. Carrier scattering at surfaces and grain boundaries leads to a dramatic increase of Cu resistivity at the nanoscale, resulting in increasing resistance-capacitance signal delay [1].
URI: http://hdl.handle.net/10397/8149
DOI: 10.1109/MNANO.2010.939831
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