Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/81077
Title: | A thermal sensitivity-based approach for enhancing robustness of ultrasonic evaluation of material acoustic nonlinearity | Authors: | Wang, K Su, Z Yan, S |
Issue Date: | Apr-2019 | Source: | Proceedings of SPIE : the International Society for Optical Engineering, 2019, v. 10972 | Abstract: | Despite demonstrated effectiveness in characterizing material properties or defect, the evaluation of material acoustic nonlinearity is highly prone to measurement contaminations introduced by various practical factors and the low robustness restricts its application. In order to obtain a precise quantification of the material acoustic nonlinearity in a robust manner, an approach based on the thermal fluctuations in nonlinear features of ultrasonic waves is developed. In this approach, the influence of temperature and defect on the interatomic distance is scrutinized analytically, and on this basis, the nonlinear features of ultrasonic waves linked with the temperature and defect is ascertained explicitly, whereby a thermal sensitivity index is proposed. With this thermal sensitivity index, the material acoustic nonlinearity can be evaluated without being affected by contaminations from practical sources, and therefore the defect which intensifies the material acoustic nonlinearity can be identified in a robust manner. Experimental validation corroborates the theoretical prediction, demonstrating that the proposed thermal sensitivity-based approach is capable of enhancing the robustness of material acoustic nonlinearity evaluation and defect characterization. | Keywords: | Material acoustic nonlinearity Thermal sensitivity Defect characterization Robustness enhancement |
Publisher: | SPIE-International Society for Optical Engineering | Journal: | Proceedings of SPIE : the International Society for Optical Engineering | ISSN: | 0277-786X | EISSN: | 1996-756X | DOI: | 10.1117/12.2513880 | Description: | SPIE Smart Structures + Nondestructive Evaluation, 2019, Denver, Colorado, United States, 3-7 March 2019 | Rights: | Posted with permission of the authors and publisher. |
Appears in Collections: | Conference Paper |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
wang_thermal_sensitivity_based.pdf | 484.38 kB | Adobe PDF | View/Open |
Page views
162
Last Week
1
1
Last month
Citations as of Oct 13, 2024
Downloads
169
Citations as of Oct 13, 2024
Google ScholarTM
Check
Altmetric
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.