Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/81077
Title: A thermal sensitivity-based approach for enhancing robustness of ultrasonic evaluation of material acoustic nonlinearity
Authors: Wang, K
Su, Z 
Yan, S
Keywords: Material acoustic nonlinearity
Thermal sensitivity
Defect characterization
Robustness enhancement
Issue Date: Apr-2019
Publisher: SPIE-International Society for Optical Engineering
Source: Proceedings of SPIE : the International Society for Optical Engineering, 2019, v. 10972 How to cite?
Journal: Proceedings of SPIE : the International Society for Optical Engineering 
Abstract: Despite demonstrated effectiveness in characterizing material properties or defect, the evaluation of material acoustic nonlinearity is highly prone to measurement contaminations introduced by various practical factors and the low robustness restricts its application. In order to obtain a precise quantification of the material acoustic nonlinearity in a robust manner, an approach based on the thermal fluctuations in nonlinear features of ultrasonic waves is developed. In this approach, the influence of temperature and defect on the interatomic distance is scrutinized analytically, and on this basis, the nonlinear features of ultrasonic waves linked with the temperature and defect is ascertained explicitly, whereby a thermal sensitivity index is proposed. With this thermal sensitivity index, the material acoustic nonlinearity can be evaluated without being affected by contaminations from practical sources, and therefore the defect which intensifies the material acoustic nonlinearity can be identified in a robust manner. Experimental validation corroborates the theoretical prediction, demonstrating that the proposed thermal sensitivity-based approach is capable of enhancing the robustness of material acoustic nonlinearity evaluation and defect characterization.
Description: SPIE Smart Structures + Nondestructive Evaluation, 2019, Denver, Colorado, United States, 3-7 March 2019
URI: http://hdl.handle.net/10397/81077
ISSN: 0277-786X
EISSN: 1996-756X
DOI: 10.1117/12.2513880
Rights: Posted with permission of the authors and publisher.
Appears in Collections:Conference Paper

Files in This Item:
File Description SizeFormat 
wang_thermal_sensitivity_based.pdf484.38 kBAdobe PDFView/Open
Access
View full-text via PolyU eLinks SFX Query
Show full item record
PIRA download icon_1.1View/Download Contents

Page view(s)

5
Citations as of Sep 18, 2019

Download(s)

5
Citations as of Sep 18, 2019

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.