Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/77570
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dc.contributorDepartment of Industrial and Systems Engineering-
dc.creatorXiao, G-
dc.creatorRen, M-
dc.creatorTo, S-
dc.date.accessioned2018-08-28T01:33:18Z-
dc.date.available2018-08-28T01:33:18Z-
dc.identifier.urihttp://hdl.handle.net/10397/77570-
dc.language.isoenen_US
dc.publisherMolecular Diversity Preservation International (MDPI)en_US
dc.rights© 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).en_US
dc.rightsThe following publication Xiao, G., Ren, M., & To, S. (2018). A study of mechanics in brittle-ductile cutting mode transition. Micromachines, 9(2), (Suppl. ), 49, - is available athttps://dx.doi.org/10.3390/mi9020049en_US
dc.subjectBrittle-ductile cutting mode transitionen_US
dc.subjectCritical undeformed chip thicknessen_US
dc.subjectMechanics analysisen_US
dc.subjectSilicon carbideen_US
dc.subjectUltra-precision machiningen_US
dc.titleA study of mechanics in brittle-ductile cutting mode transitionen_US
dc.typeJournal/Magazine Articleen_US
dc.identifier.volume9-
dc.identifier.issue2-
dc.identifier.doi10.3390/mi9020049-
dcterms.abstractThis paper presents an investigation of the mechanism of the brittle-ductile cutting mode transition from the perspective of the mechanics. A mechanistic model is proposed to analyze the relationship between undeformed chip thickness, deformation, and stress levels in the elastic stage of the periodic chip formation process, regarding whether brittle or ductile mode deformation is to follow the elastic stage. It is revealed that, the distance of tool advancement required to induce the same level of compressive stress decreases with undeformed chip thickness, and thereby the tensile stress below and behind the tool decreases with undeformed chip thickness. As a result, the tensile stress becomes lower than the critical tensile stress for brittle fracture when the undeformed chip thickness becomes sufficiently small, enabling the brittle-ductile cutting mode transition. The finite element method is employed to verify the analysis of the mechanics on a typical brittle material 6H silicon carbide, and confirmed that the distance of the tool advancement required to induce the same level of compressive stress becomes smaller when the undeformed chip thickness decreases, and consequently smaller tensile stress is induced below and behind the tool. The critical undeformed chip thicknesses for brittle-ductile cutting mode transition are estimated according to the proposed mechanics, and are verified by plunge cutting experiments in a few crystal directions. This study should contribute to better understanding of the mechanism of brittle-ductile cutting mode transition and the ultra-precision machining of brittle materials.-
dcterms.accessRightsopen accessen_US
dcterms.bibliographicCitationMicromachines, Feb. 2018, v. 9, no. 2, 49, p. 1-17-
dcterms.isPartOfMicromachines-
dcterms.issued2018-
dc.identifier.isiWOS:000427530300009-
dc.identifier.scopus2-s2.0-85041513632-
dc.identifier.eissn2072-666X-
dc.identifier.artn49-
dc.identifier.rosgroupid2017003807-
dc.description.ros2017-2018 > Academic research: refereed > Publication in refereed journal-
dc.description.validate201808 bcrc-
dc.description.oaVersion of Recorden_US
dc.identifier.FolderNumberOA_IR/PIRAen_US
dc.description.pubStatusPublisheden_US
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