Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/77447
Title: Interfacial engineering of printable bottom back metal electrodes for full-solution processed flexible organic solar cells
Authors: Zhen, H 
Li, K 
Zhang, Y 
Chen, L 
Niu, L 
Wei, X 
Fang, X
You, P 
Liu, Z 
Wang, D 
Yan, F 
Zheng, Z 
Issue Date: 2018
Source: Journal of semiconductors, 2018, v. 39, no. 1, 14002
Abstract: Printing of metal bottom back electrodes of flexible organic solar cells (FOSCs) at low temperature is of great significance to realize the full-solution fabrication technology. However, this has been difficult to achieve because often the interfacial properties of those printed electrodes, including conductivity, roughness, work function, optical and mechanical flexibility, cannot meet the device requirement at the same time. In this work, we fabricate printed Ag and Cu bottom back cathodes by a low-temperature solution technique named polymer-assisted metal deposition (PAMD) on flexible PET substrates. Branched polyethylenimine (PEI) and ZnO thin films are used as the interface modification layers (IMLs) of these cathodes. Detailed experimental studies on the electrical, mechanical, and morphological properties, and simulation study on the optical properties of these IMLs are carried out to understand and optimize the interface of printed cathodes. We demonstrate that the highest power conversion efficiency over 3.0% can be achieved from a full-solution processed OFSC with the device structure being PAMD-Ag/PEI/P3HT:PC61BM/PH1000. This device also acquires remarkable stability upon repeating bending tests.
Keywords: Flexible organic solar cells
Full-solution processed
Interface modification layers
Polymer-assisted metal deposition
Printed electrodes
Publisher: Institute of Physics Publishing
Journal: Journal of semiconductors 
ISSN: 1674-4926
DOI: 10.1088/1674-4926/39/1/014002
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