Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/76841
Title: Quantitative, elastoplastic phase-field model for microstructural evolution in solids under stress and temperature gradients
Authors: Shi, SQ 
Keywords: Quantitative computer modeling
Phase-field method
Stress
Temperature gradient
Issue Date: 2015
Publisher: Scientech Publishing Co.
Source: 6th International Conference on Computational Methods (ICCM2015), Auckland, New Zealand, July 14-17, 2015 (CD-ROM) How to cite?
Abstract: Quantitative prediction of three-dimensional microstructure evolution during phase transformation in solids is often very challenging, especially when stress, composition and temperature gradients are present, together with plastic deformation. This paper takes hydride precipitation in zirconium alloys and void growth in irradiated metals as examples and shows how it could be done in nano-, micro, meso- and macro-scales within phase-field scheme. In recent years, the author’s research team has developed a phase-field scheme to simulate the morphological and microstructural evolution of hydride precipitation in single and polycrystalline zirconium under uniform and nonuniform stress and temperature fields. Recent effort was devoted to develop a quantitative model for hydride precipitation and void growth. The model for hydrides takes into account crystallographic variants of hydrides, interfacial energy between hydride and matrix, interfacial energy between different hydrides, elastoplastic hydride precipitation and interaction with externally applied stress and/or temperature field. The model for hydrides and for void are fully quantitative in real time and real length scale, and simulation results were compared with limited experimental data available in the literature with reasonable agreement. However, some numerical and physical issues remain to be solved.
Description: International Conference on Computational Methods (ICCM 6th: 2015), Auckland, NZ, 14-17th July 2015
URI: http://hdl.handle.net/10397/76841
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